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NCP9002 Datasheet(PDF) 1 Page - ON Semiconductor

No. de Pieza. NCP9002
Descripción  1.3 Watt Audio Power Amplifier with Fast Turn On Time
Descarga  13 Pages
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Fabricante  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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NCP9002 Datasheet(HTML) 1 Page - ON Semiconductor

 
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© Semiconductor Components Industries, LLC, 2006
December, 2006 − Rev. 4
1
Publication Order Number:
NCP9002/D
NCP9002
1.3 Watt Audio Power
Amplifier with Fast Turn On
Time
The NCP9002 is an audio power amplifier designed for portable
communication device applications such as mobile phone
applications. The NCP9002 is capable of delivering 1.3 W of
continuous average power to an 8.0
W BTL load from a 5.0 V power
supply, and 1.0 W to a 4.0
W BTL load from a 3.6 V power supply.
The NCP9002 provides high quality audio while requiring few
external components and minimal power consumption. It features a
low−power consumption shutdown mode, which is achieved by
driving the SHUTDOWN pin with logic low.
The NCP9002 contains circuitry to prevent from “pop and click”
noise that would otherwise occur during turn−on and turn−off
transitions.
For maximum flexibility, the NCP9002 provides an externally
controlled gain (with resistors), as well as an externally controlled
turn−on time (with the bypass capacitor). When using a 1
mF bypass
capacitor, it offers 100 ms wake up time.
Due to its excellent PSRR, it can be directly connected to the
battery, saving the use of an LDO.
This device is available in a 9−Pin Flip−Chip CSP (Lead−Free).
Features
1.3 W to an 8.0 W BTL Load from a 5.0 V Power Supply
Excellent PSRR: Direct Connection to the Battery
“Pop and Click” Noise Protection Circuit
Ultra Low Current Shutdown Mode: 10 nA
2.2 V−5.5 V Operation
External Gain Configuration Capability
External Turn−on Time Configuration Capability:
100 ms (1
mF Bypass Capacitor)
Up to 1.0 nF Capacitive Load Driving Capability
Thermal Overload Protection Circuitry
This is a Pb−Free Device
Typical Applications
Portable Electronic Devices
PDAs
Wireless Phones
9−Pin Flip−Chip CSP
FC SUFFIX
CASE 499AL
PIN CONNECTIONS
MAZ
= Specific Device Code
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
MARKING
DIAGRAMS
A3
B3
C3
A2
B2
C2
A1
B1
C1
INM
OUTA
INP
VM_P
VM
Vp
BYPASS
OUTB SHUTDOWN
9−Pin Flip−Chip CSP
(Top View)
A1
See detailed ordering and shipping information in the package
dimensions section on page 12 of this data sheet.
ORDERING INFORMATION
MAZ
G
AYWW
A1
A3
C1
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