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LPC3180 Datasheet(PDF) 2 Page - NXP Semiconductors

No. de Pieza. LPC3180
Descripción  16/32-bit ARM microcontroller; hardware floating-point coprocessor, USB On-The-Go, and SDRAM memory interface
Descarga  36 Pages
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Fabricante  PHILIPS [NXP Semiconductors]
Página de inicio  http://www.nxp.com
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LPC3180 Datasheet(HTML) 2 Page - NXP Semiconductors

 
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LPC3180_1
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Preliminary data sheet
Rev. 01 — 2 June 2006
2 of 36
Philips Semiconductors
LPC3180
16/32-bit ARM microcontroller with external memory interface
I Up to 55 GPI, GPO, and GPIO pins. Includes 12 GPI pins, 24 GPO pins, and six GPIO
pins.
I 10-bit ADC with input multiplexing from three pins.
I Real-Time Clock (RTC) with separate power supply and power domain, clocked by a
dedicated 32 kHz oscillator. Includes a 128 byte scratch pad memory. The RTC may
remain active when the rest of the chip is not powered.
I 32-bit general purpose high-speed timer with 16-bit pre-scaler with capture and
compare capability.
I 32-bit millisecond timer driven from the RTC clock. Interrupts may be generated using
two match registers.
I Watchdog timer.
I Two PWM blocks with an output rate up to 50 kHz.
I Keyboard scanner function provides automatic scanning of up to an 8 × 8 key matrix.
I Standard ARM test/debug interface for compatibility with existing tools.
I Emulation trace buffer with 2 k × 24-bit RAM allows trace via JTAG.
I On-chip crystal oscillator.
I Stop mode saves power, while allowing many peripheral functions to restart CPU
activity.
I On-chip PLL allows CPU operation up to the maximum CPU rate without the need for
a high frequency crystal.
I Boundary scan for simplified board testing.
3.
Ordering information
[1]
F =
−40 °C to +85 °C temperature range.
Table 1.
Ordering information
Type number
Package
Name
Description
Version
LPC3180FEL320[1]
LFBGA320
plastic low profile fine-pitch ball grid array
package; 320 balls; body 13
× 13 × 0.9 mm
SOT824-1


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