AlGaAs Beam Lead PIN Diode

MA4AGBLP912

V 1.00

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3

General Handling

These devices have a polymer layer which provides scratch

protection for the junction area and the anode air bridge. Beam

lead devices must, however, be handled with extreme care

since the leads may easily be distorted or broken by the normal

pressures exerted when handled with tweezers. A vacuum

pencil with a #27 tip is recommended for picking and placing.

These devices were designed to be inserted onto hard or soft

substrates. Recommended methods of attachment include ther-

mocompression bonding, parallel-gap welding, solder reflow,

and electrically conductive silver epoxy.

See Application Note M541, “Bonding and Handling Proce-

dures for Chip Diode Devices” for More Detailed Assembly

Instructions.

Assembly Considerations

The following precautions should be observed to avoid

damaging these chips.

Cleanliness

These devices should be handled in a clean environment. Do

not attempt to clean die after installation.

Static Sensitivity

Aluminum Gallium Arsenide PIN diodes are Class 1 ESD

sensitive and can be damaged by static electricity. Proper ESD

techniques should be used when handling these devices.

Rs

Ct

Ls = 0.5 nH

Diode Model