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MC9S08AW60 Datasheet(PDF) 28 Page - Freescale Semiconductor, Inc

No. de Pieza. MC9S08AW60
Descripción  Microcontrollers
Descarga  324 Pages
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Fabricante  FREESCALE [Freescale Semiconductor, Inc]
Página de inicio  http://www.freescale.com
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MC9S08AW60 Datasheet(HTML) 28 Page - Freescale Semiconductor, Inc

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Chapter 2 Pins and Connections
MC9S08AW60 Data Sheet, Rev 2
28
Freescale Semiconductor
2.3.1
Power (VDD, 2 x VSS, VDDAD, VSSAD)
VDD and VSS are the primary power supply pins for the MCU. This voltage source supplies power to all
I/O buffer circuitry and to an internal voltage regulator. The internal voltage regulator provides regulated
lower-voltage source to the CPU and other internal circuitry of the MCU.
Typically, application systems have two separate capacitors across the power pins. In this case, there
should be a bulk electrolytic capacitor, such as a 10-
μF tantalum capacitor, to provide bulk charge storage
for the overall system and a 0.1-
μF ceramic bypass capacitor located as near to the paired VDD and VSS
power pins as practical to suppress high-frequency noise. The MC9S08AW60 has a second VSS pin. This
pin should be connected to the system ground plane or to the primary VSS pin through a low-impedance
connection.
VDDAD and VSSAD are the analog power supply pins for the MCU. This voltage source supplies power to
the ADC module. A 0.1-
μF ceramic bypass capacitor should be located as near to the analog power pins
as practical to suppress high-frequency noise.
2.3.2
Oscillator (XTAL, EXTAL)
Out of reset, the MCU uses an internally generated clock (self-clocked mode — fSelf_reset) equivalent to
about 8-MHz crystal rate. This frequency source is used during reset startup and can be enabled as the
clock source for stop recovery to avoid the need for a long crystal startup delay. This MCU also contains
a trimmable internal clock generator (ICG) module that can be used to run the MCU. For more information
on the ICG, see the Chapter 8, “Internal Clock Generator (S08ICGV4).”
The oscillator amplitude on XTAL and EXTAL is gain limited for low-power oscillation. Typically, these
pins have a 1-V peak-to-peak signal. For noisy environments, the high gain output (HGO) bit can be set to
enable rail-to-rail oscillation.
The oscillator in this MCU is a Pierce oscillator that can accommodate a crystal or ceramic resonator in
either of two frequency ranges selected by the RANGE bit in the ICGC1 register. Rather than a crystal or
ceramic resonator, an external oscillator can be connected to the EXTAL input pin.
Refer to Figure 2-4 for the following discussion. RS (when used) and RF should be low-inductance
resistors such as carbon composition resistors. Wire-wound resistors, and some metal film resistors, have
too much inductance. C1 and C2 normally should be high-quality ceramic capacitors that are specifically
designed for high-frequency applications.
RF is used to provide a bias path to keep the EXTAL input in its linear range during crystal startup and its
value is not generally critical. Typical systems use 1 M
Ω to 10 MΩ. Higher values are sensitive to humidity
and lower values reduce gain and (in extreme cases) could prevent startup.
C1 and C2 are typically in the 5-pF to 25-pF range and are chosen to match the requirements of a specific
crystal or resonator. Be sure to take into account printed circuit board (PCB) capacitance and MCU pin
capacitance when sizing C1 and C2. The crystal manufacturer typically specifies a load capacitance which
is the series combination of C1 and C2 which are usually the same size. As a first-order approximation,
use 10 pF as an estimate of combined pin and PCB capacitance for each oscillator pin (EXTAL and
XTAL).


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