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ST-32 Datasheet(PDF) 4 Page - Vishay Siliconix

No. de Pieza. ST-32
Descripción  Surface Mount Cermet Trimmers (single turn)
Descarga  7 Pages
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Fabricante  VISHAY [Vishay Siliconix]
Página de inicio  http://www.vishay.com
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ST-32 Datasheet(HTML) 4 Page - Vishay Siliconix

   
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Document Number: 58009
For technical questions contact: copalsupport@vishay.com
www.vishay.com
Revision: 06-Mar-06
4
ST-32
Surface Mount Cermet Trimmers (single turn)
Vishay
MECHANICAL SPECIFICATIONS
Mechanical turn
250
° (1 turn)
Operating torque
5 mN m {51 gf cm} maximum
Stop Strength
20 mN m {204 gf cm} minimum
Rotational life
100 cycles
[
ΔR/R ≤ ± (2 Ω + 3 %)]
Thrust to rotor
5 N {0.51 kgf} minimum
Solderability
Sn-Pb: 235
°C, 2 s
Sn-Cu (Lead (Pb)-free): 245 ± 3
°C, 2 ∼ 3 s
Shear (Adhesion)
5 N {0.51 kgf} 10 s
Substrate bending
Width 90 mm, bend 3 mm, 5 s, 1 time
Pull-off strength
5 N {0.51 kgf} 10 s
ELECTRICAL CHARACTERISTICS
Nominal resistance
range
10
Ω ∼ 2 MΩ
Resistance tolerance
± 20 %
Power ratings
0.125 W (70
°C) 0 W (125 °C)
Resistance law
Linear law (B)
Maximum input
voltage
DC200 V or power rating, whichever is
smaller
Maximum wiper
current
100 mA or power rating, whichever is
smaller
Effective electrical
angle
210
° (1 turn)
End resistance
1 % or 2
Ω, whichever is greater
C.R.V.
1 % or 3
Ω, whichever is greater
Operating temp. range
- 55
∼ 125 °C
Temp. coefficient
10
Ω ∼ 50 Ω: ± 250 10-6 /°C maximum
100
Ω ∼ 2 MΩ: ± 100 10-6 /°C maximum
Insulation resistance
1000 M
Ω minimum (DC500 V)
Dielectric strength
AC500 V, 60 s
Net weight
Approx. 0.05 g (ST-32A, B, EA, EB)
Approx. 0.11 g (ST-32G, H, EG, EH)
ENVIRONMENTAL SPECIFICATIONS
Test item
Test conditions
Specifications
Thermal shock
- 65
∼ 125 °C (0.5 h),
5 cycles
[
ΔR/R ≤ 2 %]
[S.S.
≤ 1 %]
Humidity
- 10
∼ 65 °C (Relative
humidity 80
∼ 98 %),
10 cycles, 240 h
[
ΔR/R ≤ 2 %]
Shock
981 m/s2, 6 ms
6 directions for 3 times
each
[
ΔR/R ≤ 1 %]
[S.S.
≤ 1 %]
Vibration
Amplitude 1.52 mm or
Acceleration 196 m/s2,
10
∼ 2000 Hz,
3 directions, 12 times
each
Load Life
70
°C, 0.125 W, 1000 h
[
ΔR/R ≤ 3 %]
[S.S.
≤ 1 %]
Low
temperature
operation
- 55
°C, 2 h
[
ΔR/R ≤ 2 %]
[S.S.
≤ 2 %]
High
temperature
exposure
125
°C, 250 h
[
ΔR/R ≤ 3 %]
[S.S.
≤ 2 %]
Immersion seal
85
°C, 60 s
No leaks (No
continuous bubbles)
Soldering heat
Sn-Pb
260
°C, 10 s or 215 °C,
35 s
[
ΔR/R ≤ 1 %]
S-Cu
Flow: 260
°C ± 3 °C as
the temperature in a pot
of molten solder,
immersion from head of
terminal to backside of
board, 5
∼ 6 s, two times
maximum
Reflow: Peak
temperature 255
°C
(Please refer to the
profile below.)
Manual soldering:
350 ± 10
°C, 3 ∼ 4 s
Reflow profile for soldering heat evaluation
Reflow : two times maximum
Peak : 250
Over 230 °C
Pre Heating Zone
180°C
(°C)
250
200
150
100
50
150°C
90 ± 30 s
30 ± 10 s
Soldering Zone
Heating time
°C
+5
0


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