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HSMP-381B Datasheet(PDF) 1 Page - Agilent(Hewlett-Packard)

No. de Pieza. HSMP-381B
Descripción  Surface Mount PIN Diodes in SOT-323 (SC-70 3-Lead)
Descarga  12 Pages
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Fabricante  HP [Agilent(Hewlett-Packard)]
Página de inicio  http://www.home.agilent.com
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HSMP-381B Datasheet(HTML) 1 Page - Agilent(Hewlett-Packard)

 
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Surface Mount PIN Diodes
in SOT-323 (SC-70 3-Lead)
Technical Data
Features
• Diodes Optimized for:
Low Current Switching
Low Distortion Attenuating
Ultra-Low Distortion Switching
Microwave Frequency
Operation
• Surface Mount SOT-323
(SC-70)Package
Single and Pair Versions
Tape and Reel Options
Available
• Low Failure in Time (FIT)
Rate*
* For more information see the
Surface Mount PIN Reliability
Data Sheet.
Package Lead Code
Identification
(Top View)
Description/Applications
The HSMP-381B/C/E/F series is
specifically designed for low
distortion attenuator applications.
The HSMP-386B/C/E/F series is a
general purpose PIN diode
designed for low current attenua-
tors and low cost switches. The
HSMP-389B/C/E/ F series is
optimized for switching applica-
tions where low resistance at low
current, and low capacitance are
required.
The HSMP-48XB series is special
products featuring ultra low
parasitic inductance in the SOT-
323 package, specifically designed
for use at frequencies which are
much higher than the upper limit
for conventional SOT-323 PIN
diodes. The HSMP-481B diode is a
low distortion attenuating PIN
designed for operation to 3 GHz.
The HSMP-482B diode is ideal for
limiting and low inductance
switching applications up to
1.5 GHz. The HSMP-489B is
optimized for low current switch-
ing applications up to 3 GHz.
COMMON
CATHODE
F
COMMON
ANODE
E
SERIES
C
SINGLE
B
DUAL ANODE
482B / 489B
DUAL CATHODE
481B
HSMP-381B/C/E/F
HSMP-386B/C/E/F
HSMP-389B/C/E/F
HSMP-481B, -482B, -489B
Absolute Maximum Ratings[1], T
C = + 25°C
Symbol Parameter
Unit
Absolute Maximum
If
Forward Current (1
µs Pulse) Amp
1
Piv
Peak Inverse Voltage
V
Same as V
BR
T
J
Junction Temperature
°C
150
T
STG
Storage Temperature
°C
-65 to 150
θ
jc
Thermal Resistance[2]
°C/W
300
Notes:
1. Operation in excess of any one of these conditions may result in
permanent damage to the device.
2. TC = 25°C, where TC is defined to be the temperature at the package
pins where contact is made to the circuit board.


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