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CDC906PW Datasheet(PDF) 4 Page - Texas Instruments |
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CDC906PW Datasheet(HTML) 4 Page - Texas Instruments |
4 / 39 page www.ti.com ABSOLUTE MAXIMUM RATINGS PACKAGE THERMAL RESISTANCE CDC906 SCAS828 – SEPTEMBER 2006 TERMINAL FUNCTIONS TERMINAL I/O DESCRIPTION TSSOP20 NAME NO. 11, 12, 15, Y0 to Y5 O LVCMOS outputs 16, 19, 20 Dependent on SMBus settings, CLK_IN0 is the crystal oscillator input and can also be used as CLK_IN0 5 I LVCMOS input or as positive differential signal inputs. Dependent on SMBus settings, CLK_IN1 is serving as the crystal oscillator output or can be the CLK_IN1 6 I/O second LVCMOS input or the negative differential signal input. VCC 3, 7 Power 3.3-V power supply for the device VCCOUT1 14 Power Power 2.5-V to 3.3-V power supply for outputs Y0, Y1 VCCOUT2 18 Power Power 2.5-V to 3.3-V power supply for outputs Y2, Y3, Y4, Y5 GND 4, 8, 13, 17 Ground Ground User programmable control input S0 (PLL bypass or power-down mode) or CLK_SEL (selects one S0, 1 I of two LVCMOS clock inputs), dependent on the SMBus settings; LVCMOS inputs; internal pullup CLK_SEL 150 k Ω. User programmable control input S1 (output enable/disable or all output low), dependent on the S1 2 I SMBus settings; LVCMOS inputs; internal pullup 150 k Ω SDATA 9 I/O Serial control data input/output for SMBus controller; LVCMOS input SCLOCK 10 I Serial control clock input for SMBus controller; LVCMOS input over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT VCC Supply voltage range –0.5 to 4.6 V VI Input voltage range(2) –0.5 to VCC + 0.5 V VO Output voltage range(2) – 0.5 to VCC + 0.5 V II Input current (VI < 0, V I > VCC) ±20 mA IO Continuous output current ±50 mA Tstg Storage temperature range –65 to 150 °C TJ Maximum junction temperature 125 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. (2) The input and output negative voltage ratings may be exceeded if the input and output clamp-current ratings are observed. for TSSOP20 (PW) Package(1)(2) PARAMETER AIRFLOW (LFM) °C/W 0 66.3 150 59.3 θ JA Thermal resistance junction-to-ambient 250 56.3 500 51.9 θ JC Thermal resistance junction-to-case 19.7 (1) The package thermal impedance is calculated in accordance with JESD 51 and JEDEC2S2P (high-k board). (2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com. 4 Submit Documentation Feedback |
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