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TPA032D01 Datasheet(PDF) 21 Page - Texas Instruments |
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TPA032D01 Datasheet(HTML) 21 Page - Texas Instruments |
21 / 25 page TPA032D01 10W MONO CLASSD AUDIO POWER AMPLIFIER SLOS282B − DECEMBER 1999 − REVISED JUNE 2000 21 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 THERMAL INFORMATION The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 12) to provide an effective thermal contact between the IC and the PWB. Traditionally, surface-mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages, however, have only two shortcomings: they do not address the very low profile requirements (< 2 mm) of many of today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing integration. On the other hand, traditional low-power surface-mount packages require power-dissipation derating that severely limits the usable range of many high-performance analog circuits. The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal performance comparable to much larger power packages. The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally coupled to an external heat dissipator, high power dissipation in the ultrathin, fine-pitch, surface-mount package can be reliably achieved. DIE Side View (a) End View (b) Bottom View (c) DIE Thermal Pad Figure 12. Views of Thermally Enhanced DCA Package |
Número de pieza similar - TPA032D01_07 |
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Descripción similar - TPA032D01_07 |
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