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TL780-05CKTTR Datasheet(PDF) 2 Page - Texas Instruments |
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TL780-05CKTTR Datasheet(HTML) 2 Page - Texas Instruments |
2 / 14 page www.ti.com COMMON OUTPUT INPUT Absolute Maximum Ratings (1) Package Thermal Data (1) TL780 SERIES POSITIVE-VOLTAGE REGULATORS SLVS055M – APRIL 1981 – REVISED OCTOBER 2006 SCHEMATIC over operating temperature ranges (unless otherwise noted) MIN MAX UNIT VI Input voltage 35 V TJ Operating virtual junction temperature 150 °C Lead temperature 1,6 mm (1/16 in) from case for 10 s 260 °C Tstg Storage temperature range –65 150 °C (1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. PACKAGE BOARD θ JP (2) θ JC θ JA PowerFLEX (KTE) High K, JESD 51-5 2.7 °C/W 11.6 °C/W 23.3 °C/W TO-220 (KC/KCS) High K, JESD 51-5 3 °C/W 17 °C/W 19 °C/W TO-263 (KTT) High K, JESD 51-5 1.91 °C/W 18 °C/W 25.3 °C/W (1) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. Due to variations in individual device electrical characteristics and thermal resistance, the built-in thermal overload protection may be activated at power levels slightly above or below the rated dissipation. (2) For packages with exposed thermal pads, such as QFN, PowerPAD™, or PowerFLEX, θ JP is defined as the thermal resistance between the die junction and the bottom of the exposed pad. 2 Submit Documentation Feedback |
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