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CS8221YDP3 Datasheet(PDF) 5 Page - ON Semiconductor

No. de pieza CS8221YDP3
Descripción Electrónicos  Micropower 5.0 V, 100 mA Low Dropout Linear Regulator
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Fabricante Electrónico  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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CS8221YDP3 Datasheet(HTML) 5 Page - ON Semiconductor

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CS8221
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5
Once the minimum capacitor value with the maximum
ESR is found, a safety factor should be added to allow for the
tolerance of the capacitor and any variations in regulator
performance. Most good quality aluminum electrolytic
capacitors have a tolerance of
± 20% so the minimum value
found should be increased by at least 50% to allow for this
tolerance plus the variation which will occur at low
temperatures. The ESR of the capacitor should be less than
50% of the maximum allowable ESR found in step 3 above.
CALCULATING POWER DISSIPATION IN A SINGLE
OUTPUT LINEAR REGULATOR
The maximum power dissipation for a single output
regulator (Figure 5) is:
PD(max) + VIN(max) * VOUT(min) IOUT(max) ) VIN(max)IQ
(1)
where:
VIN(max) is the maximum input voltage,
VOUT(min) is the minimum output voltage,
IOUT(max) is the maximum output current for the
application, and
IQ is the quiescent current the regulator consumes at
IOUT(max).
Once the value of PD(max) is known, the maximum
permissible value of RΘJA can be calculated:
R
QJA +
150
°C * TA
PD
(2)
The value of RΘJA can then be compared with those in the
package section of the data sheet. Those packages with
RΘJA’s less than the calculated value in equation 2 will keep
the die temperature below 150
°C.
In some cases, none of the packages will be sufficient to
dissipate the heat generated by the IC, and an external
heatsink will be required.
Figure 5. Single Output Regulator With Key
Performance Parameters Labeled
CS8221
IOUT
IIN
IQ
VIN
VOUT
HEAT SINKS
A heat sink effectively increases the surface area of the
package to improve the flow of heat away from the IC and
into the surrounding air.
Each material in the heat flow path between the IC and the
outside environment will have a thermal resistance. Like
series electrical resistances, these resistances are summed to
determine the value of RΘJA.
R
QJA + RQJC ) RQCS ) RQSA
(3)
where:
RΘJC = the junction−to−case thermal resistance,
RΘCS = the case−to−heatsink thermal resistance, and
RΘSA = the heatsink−to−ambient thermal resistance.
RΘJC appears in the package section of the data sheet. Like
RΘJA, it too is a function of package type. RΘCS and RΘSA
are functions of the package type, heatsink and the interface
between them. These values appear in heat sink data sheets
of heat sink manufacturers.


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