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LM2931 Datasheet(PDF) 3 Page - ON Semiconductor

No. de Pieza. LM2931
Descripción  100 mA, Adjustable Output, LDO Voltage Regulator with 60 V Load Dump Protection
Descarga  23 Pages
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Fabricante  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
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LM2931 Datasheet(HTML) 3 Page - ON Semiconductor

 
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LM2931, NCV2931 Series
http://onsemi.com
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Input Voltage Continuous
VI
40
Vdc
Transient Input Voltage (
t ≤ 100 ms)
VI(t)
60
Vpk
Transient Reverse Polarity Input Voltage
−VI(t)
−50
Vpk
1.0% Duty Cycle,
t ≤ 100 ms
Electrostatic Discharge Sensitivity (ESD)
Human Body Model (HBM) Class 2, JESD22 A114−C
Machine Model (MM) Class A, JESD22 A115−A
Charged Device Model (CDM), JESD22 C101−C
2000
200
2000
V
V
V
Power Dissipation
Case 29 (TO−92 Type)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
178
°C/W
Thermal Resistance, Junction−to−Case
RqJC
83
°C/W
Case 221A, 314A, 314B and 314D (TO−220 Type)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
65
°C/W
Thermal Resistance, Junction−to−Case
RqJC
5.0
°C/W
Case 318H (SOT−223)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
242
°C/W
Thermal Resistance, Junction−to−Case
RqJC
21
°C/W
Case 369A (DPAK) (Note 1)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
92
°C/W
Thermal Resistance, Junction−to−Case
RqJC
6.0
°C/W
Case 751 (SOP−8) (Note 2)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
160
°C/W
Thermal Resistance, Junction−to−Case
RqJC
25
°C/W
Case 936 and 936A (D2PAK) (Note 3)
TA = 25°C
PD
Internally Limited
W
Thermal Resistance, Junction−to−Ambient
RqJA
70
°C/W
Thermal Resistance, Junction−to−Case
RqJC
5.0
°C/W
Operating Ambient Temperature Range
TA
−40 to +125
°C
Operating Die Junction Temperature
TJ
+150
°C
Storage Temperature Range
Tstg
−65 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. DPAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 25 for board mounted Thermal Resistance.
2. SOP−8 Junction−to−Ambient Thermal Resistance is for minimum recommended pad size. Refer to Figure 24 for Thermal Resistance
variation versus pad size.
3. D2PAK Junction−to−Ambient Thermal Resistance is for vertical mounting. Refer to Figure 26 for board mounted Thermal Resistance.


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