MC74VHC1GT08

http://onsemi.com

2

MAXIMUM RATINGS

Symbol

Characteristics

Value

Unit

DC Supply Voltage

−0.5 to +7.0

V

DC Input Voltage

−0.5 to +7.0

V

DC Output Voltage

High or Low State

−0.5 to 7.0

V

Input Diode Current

−20

mA

Output Diode Current

+20

mA

DC Output Current, per Pin

+25

mA

+50

mA

Power dissipation in still air

SC−88A, TSOP−5

200

mW

Thermal resistance

SC−88A, TSOP−5

333

°C/W

Lead temperature, 1 mm from case for 10 s

260

°C

Junction temperature under bias

+150

°C

Storage temperature

−65 to +150

°C

ESD Withstand Voltage

Human Body Model (Note 1)

Machine Model (Note 2)

Charged Device Model (Note 3)

> 2000

> 200

N/A

V

Latchup Performance

±500

mA

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. Tested to EIA/JESD22−A114−A

2. Tested to EIA/JESD22−A115−A

3. Tested to JESD22−C101−A

4. Tested to EIA/JESD78

RECOMMENDED OPERATING CONDITIONS

Symbol

Characteristics

Min

Max

Unit

DC Supply Voltage

3.0

5.5

V

DC Input Voltage

0.0

5.5

V

DC Output Voltage

High or Low State

0.0

0.0

5.5

V

Operating Temperature Range

−55

+125

°C

Input Rise and Fall Time

0

0

100

20

ns/V

Device Junction Temperature versus

Time to 0.1% Bond Failures

Junction

Temperature

°C

Time, Hours

Time, Years

80

1,032,200

117.8

90

419,300

47.9

100

178,700

20.4

110

79,600

9.4

120

37,000

4.2

130

17,800

2.0

140

8,900

1.0

1

1

10

100

1000

TIME, YEARS

FAILURE RATE OF PLASTIC = CERAMIC

UNTIL INTERMETALLICS OCCUR

Figure 3. Failure Rate vs. Time Junction Temperature