NCP1547

http://onsemi.com

2

Figure 1. Application Diagram, 4.5 V − 16 V to 3.3 V @ 1.0 A Converter

D2

Vout (3.3 V)

Vin (7 V to 16 V)

D1

R2

127

R3

205

+

U1

NC

NC

NC

NC

SYNC

NC

NC

NC

Vsw

SHDNB

NC

Vfb

Vc

BOOST

Vin

GND

+

R6

10k

SHDNB

SYNC

C3

100

mF

L1

27

mH

C1

1

mF

NCP1547

C4

0.1

mF

C5

0.1

mF

C2

330

mF

MAXIMUM RATINGS*

Rating

Value

Unit

45

V

−40 to 125

°C

Lead Temperature Soldering:

Reflow: (Note 1)

240 peak

(Note 2)

°C

−65 to +150

°C

ESD

(Human Body Model)

(Machine Model)

(Charge Device Model)

2.0

200

>1.0

kV

V

kV

Package Thermal Resistance

35

°C/W

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

*The maximum package power dissipation must be observed.

1. 60 second maximum above 183

°C.

2. −5

°C/0°C allowable conditions.

Pin Name

40 V

−0.3 V

N/A

4.0 A

BOOST

40 V

−0.3 V

N/A

100 mA

40 V

−0.6 V/−1.0 V, t < 50 ns

4.0 A

10 mA

7.0 V

−0.3 V

1.0 mA

1.0 mA

SHDNB

7.0 V

−0.3 V

1.0 mA

1.0 mA

SYNC

7.0 V

−0.3 V

1.0 mA

1.0 mA

7.0 V

−0.3 V

1.0 mA

1.0 mA

*See table above for load dump.