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LMV1032-25 Datasheet(PDF) 10 Page - National Semiconductor (TI) |
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LMV1032-25 Datasheet(HTML) 10 Page - National Semiconductor (TI) |
10 / 12 page Physical Dimensions inches (millimeters) unless otherwise noted NOTE: UNLESS OTHERWISE SPECIFIED. 1. FOR SOLDER BUMP COMPOSITION, SEE "SOLDER INFORMATION" IN THE PACKAGING SECTION OF THE NATIONAL SEMICONDUCTOR WEB PAGE (www.national.com). 2. RECOMMEND NON-SOLDER MASK DEFINED LANDING PAD. 3. PIN A1 IS ESTABLISHED BY LOWER LEFT CORNER WITH RESPECT TO TEXT ORIENTATION. 4. XXX IN DRAWING NUMBER REPRESENTS PACKAGE SIZE VARIATION WHERE X1 IS PACKAGE WIDTH, X2 IS PACKAGE LENGTH AND X3 IS PACKAGE HEIGHT. 5. NO JEDEC REGISTRATION AS OF MAY 2005. 4-Bump Ultra Thin micro SMD with Large Dome Bump Technology NS Package Number URA04JJA X1 = 1.179 ± 0.030 mm X2 = 1.179 ± 0.030 mm X3 = 0.35 ± 0.075 mm www.national.com 10 |
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