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AM29DS323B120EIN Datasheet(PDF) 4 Page - SPANSION |
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AM29DS323B120EIN Datasheet(HTML) 4 Page - SPANSION |
4 / 52 page May 15, 2002 Am29DS32xG 3 ADV ANC E INFO RMAT ION TABLE OF CONTENTS Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . . 5 Special Handling Instructions for FBGA Package .......................... 6 Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 8 Device Bus Operations . . . . . . . . . . . . . . . . . . . . . 10 Table 1. Device Bus Operations ...........................................................10 Word/Byte Configuration .............................................................. 10 Requirements for Reading Array Data ......................................... 10 Writing Commands/Command Sequences .................................. 11 Accelerated Program Operation ...................................................11 Autoselect Functions .................................................................... 11 Simultaneous Read/Write Operations with Zero Latency ......................................................................... 11 Standby Mode .............................................................................. 11 Automatic Sleep Mode ................................................................. 11 RESET#: Hardware Reset Pin .....................................................12 Output Disable Mode ................................................................... 12 Table 2. Device Bank Divisions .............................................................12 Table 3. Top Boot Sector Addresses ...................................................13 Table 4. Top Boot SecSi TM Sector Addresses ..................................... 14 Table 5. Bottom Boot Sector Addresses ...............................................16 Table 6. Bottom Boot SecSi TM Sector Addresses ................................ 17 Autoselect Mode .......................................................................... 18 Table 7. Autoselect Codes, (High Voltage Method) .............................18 Sector/Sector Block Protection and Unprotection ........................ 19 Table 8. Top Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................19 Table 9. Bottom Boot Sector/Sector Block Addresses for Protection/Unprotection ...................................................................19 Write Protect (WP#) ..................................................................... 20 Temporary Sector Unprotect ........................................................ 20 Figure 1. Temporary Sector Unprotect Operation................................. 20 Figure 2. In-System Sector Protection/ Sector Unprotection Algorithms ............................................................ 21 SecSi TM (Secured Silicon) Sector Flash Memory Region .................................................................. 22 Factory Locked: SecSi Sector Programmed and Protected At the Factory ......................................................................................... 22 Customer Lockable: SecSi Sector NOT Programmed or Protected At the Factory ...................................................................................22 Hardware Data Protection ............................................................ 22 Low VCC Write Inhibit .................................................................. 23 Write Pulse “Glitch” Protection .....................................................23 Logical Inhibit ...............................................................................23 Power-Up Write Inhibit ................................................................. 23 Common Flash Memory Interface (CFI) . . . . . . . 23 Table 10. CFI Query Identification String .............................................. 23 Table 11. System Interface String......................................................... 24 Table 12. Device Geometry Definition .................................................. 24 Table 13. Primary Vendor-Specific Extended Query ............................ 25 Command Definitions . . . . . . . . . . . . . . . . . . . . . . 25 Reading Array Data ...................................................................... 25 Reset Command .......................................................................... 26 Autoselect Command Sequence ..................................................26 Enter SecSi TM Sector/Exit SecSi Sector Command Sequence ................................................................... 26 Byte/Word Program Command Sequence ................................... 26 Unlock Bypass Command Sequence ........................................... 27 Figure 3. Program Operation ................................................................ 27 Chip Erase Command Sequence ................................................. 27 Sector Erase Command Sequence .............................................. 28 Erase Suspend/Erase Resume Commands ................................ 28 Figure 4. Erase Operation .................................................................... 29 Table 14. Command Definitions ........................................................... 30 Write Operation Status . . . . . . . . . . . . . . . . . . . . 31 DQ7: Data# Polling ...................................................................... 31 Figure 5. Data# Polling Algorithm ......................................................... 31 RY/BY#: Ready/Busy# ................................................................. 32 DQ6: Toggle Bit I .......................................................................... 32 Figure 6. Toggle Bit Algorithm .............................................................. 32 DQ2: Toggle Bit II ......................................................................... 33 Reading Toggle Bits DQ6/DQ2 .................................................... 33 DQ5: Exceeded Timing Limits ...................................................... 33 DQ3: Sector Erase Timer ............................................................. 33 Table 15. Write Operation Status ......................................................... 34 Absolute Maximum Ratings . . . . . . . . . . . . . . . . 35 Figure 7. Maximum Negative Overshoot Waveform ............................. 35 Figure 8. Maximum Positive Overshoot Waveform .............................. 35 DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 36 Figure 9. I CC1 Current vs. Time (Showing Active and Automatic Sleep Currents).................................................................... 37 Figure 10. Typical I CC1 vs. Frequency................................................... 37 Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 38 Figure 11. Test Setup .......................................................................... 38 Figure 12. Input Waveforms and Measurement Levels ........................ 38 AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39 Figure 13. Read Operation Timings...................................................... 39 Figure 14. Reset Timings...................................................................... 40 Word/Byte Configuration (BYTE#) ............................................... 41 Figure 15. BYTE# Timings for Read Operations .................................. 41 Figure 16. BYTE# Timings for Write Operations .................................. 41 Erase and Program Operations ................................................... 42 Figure 17. Program Operation Timings ................................................ 43 Figure 18. Accelerated Program Timing Diagram ................................ 43 Figure 19. Chip/Sector Erase Operation Timings ................................. 44 Figure 20. Back-to-back Read/Write Cycle Timings ............................. 45 Figure 21. Data# Polling Timings (During Embedded Algorithms) ....... 45 Figure 22. Toggle Bit Timings (During Embedded Algorithms) ............ 46 Figure 23. DQ2 vs. DQ6 ....................................................................... 46 Temporary Sector Unprotect ........................................................ 47 Figure 24. Temporary Sector Unprotect Timing Diagram ..................... 47 Figure 25. Sector/Sector Block Protect and Unprotect Timing Diagram 48 Alternate CE# Controlled Erase and Program Operations ........... 49 Figure 26. Alternate CE# Controlled Write (Erase/Program) Operation Timings ................................................................................ 50 Erase And Programming Performance . . . . . . . 51 Latchup Characteristics . . . . . . . . . . . . . . . . . . . . 51 TSOP And SO Pin Capacitance . . . . . . . . . . . . . . 51 Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 51 ..................................................................................................... 51 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 52 FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm ......................... 52 TS 048—Thin Small Outline Package .......................................... 53 Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 54 Revision A (May 15, 2002) ........................................................... 54 |
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