3

FN8085.5

August 23, 2006

Absolute Maximum Ratings

(respect to ground) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7.0V

Voltage on X1 and X2 Pins

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . -65°C to +150°C

Lead Temperature (Soldering, 10s) . . . . . . . . . . . . . . . . . . . . +300°C

CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the

device at these or any other conditions above those indicated in the operational sections of this specification is not implied.

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

(Note 4)

MAX

UNITS

NOTES

Main Power Supply

2.7

5.5

V

Battery Supply Voltage

1.8

5.5

V

Supply Current

2

6

µA

1, 2

1.2

4

µA

40

120

µA

1, 2

Supply Current (Low Power Mode)

1.4

5

µA

1

Battery Supply Current

400

950

nA

1

Input Leakage Current on SCL

100

nA

I/O Leakage Current on SDA

100

nA

1.6

2.2

2.6

V

10

30

75

mV

15

50

100

mV

Output Low Voltage

0.4

V

0.4

V

SYMBOL

PARAMETER

CONDITIONS

MIN

TYP

(Note 4)

MAX

UNITS

NOTES

10

V/ms

3

Serial Interface Specifications

Over the recommended operating conditions unless otherwise specified.

SYMBOL

PARAMETER

TEST CONDITIONS

MIN

TYP

(Note 4)

MAX

UNITS

NOTES

SERIAL INTERFACE SPECS

SDA and SCL Input Buffer LOW

Voltage

-0.3

0.3 x

V

SDA and SCL Input Buffer HIGH

Voltage

0.7 x

0.3

V

Hysteresis

SDA and SCL Input Buffer Hysteresis

0.05 x

V

SDA Output Buffer LOW Voltage,

Sinking 3mA

00.4

V

ISL1208