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ATMEGA165P_0611 Datasheet(PDF) 2 Page - ATMEL Corporation |
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ATMEGA165P_0611 Datasheet(HTML) 2 Page - ATMEL Corporation |
2 / 368 page 2 8019H–AVR–11/06 ATmega165P 1. Pin Configurations Figure 1-1. Pinout ATmega165P Note: The large center pad underneath the QFN/MLF packages is made of metal and internally con- nected to GND. It should be soldered or glued to the board to ensure good mechanical stability. If the center pad is left unconnected, the package might loosen from the board. 1.1 Disclaimer Typical values contained in this datasheet are based on simulations and characterization of other AVR microcontrollers manufactured on the same process technology. Min and Max values will be available after the device is characterized. 47 46 48 45 44 43 42 41 40 39 38 37 36 35 33 34 2 3 1 4 5 6 7 8 9 10 11 12 13 14 16 15 PC0 (RXD/PCINT0) PE0 (TXD/PCINT1) PE1 DNC (XCK/AIN0/PCINT2) PE2 (AIN1/PCINT3) PE3 (USCK/SCL/PCINT4) PE4 (DI/SDA/PCINT5) PE5 (DO/PCINT6) PE6 (CLKO/PCINT7) PE7 (SS/PCINT8) PB0 (SCK/PCINT9) PB1 (MOSI/PCINT10) PB2 (MISO/PCINT11) PB3 (OC0A/PCINT12) PB4 (OC1B/PCINT14) PB6 (OC1A/PCINT13) PB5 PC1 PG0 PC2 PC3 PC4 PC5 PC6 PC7 PA7 PG2 PA6 PA5 PA4 PA3 PG1 INDEX CORNER |
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