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TPS79633KTTT Datasheet(PDF) 11 Page - Texas Instruments |
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TPS79633KTTT Datasheet(HTML) 11 Page - Texas Instruments |
11 / 33 page www.ti.com RθJAmax + (125 * 55)°C 2.5 W + 28°C W (9) T J + T A ) P Dmax x R θJA (6) RθJA + T J–TA P Dmax (7) 15 20 25 30 35 40 0.1 1 10 100 Copper Heatsink Area − cm2 No Air Flow 150 LFM 250 LFM DDPAK Power Dissipation 1 oz. Copper Power Plane 1 oz. Copper Ground Plane 2 oz. Copper Solder Pad with 25 Thermal Vias Thermal Vias, 0.3 mm Diameter, 1,5 mm Pitch P Dmax + (5 * 2.5) V x 1 A + 2.5 W (8) TPS796xx SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006 Even if no external black body radiator type heatsink is attached to the package, the board on which the regulator is mounted provides some heatsinking From Figure 25, DDPAK Thermal Resistance vs through the pin solder connections. Some packages, Copper Heatsink Area, the ground plane needs to be like the DDPAK and SOT223 packages, use a 1cm2 for the part to dissipate 2.5W. The operating copper plane underneath the package or the circuit environment used in the computer model to construct board's ground plane for additional heatsinking to Figure 25 consisted of a standard JEDEC High-K improve their thermal performance. Computer-aided board (2S2P) with a 1-oz. internal copper plane and thermal modeling can be used to compute very ground plane. The package is soldered to a 2-oz. accurate approximations of an integrated circuit's copper pad. The pad is tied through thermal vias to thermal performance in different operating the 1-oz. ground plane. Figure 26 shows the side environments (e.g., different types of circuit boards, view of the operating environment used in the different types and sizes of heatsinks, and different computer model. air flows, etc.). Using these models, the three thermal resistances can be combined into one thermal resistance between junction and ambient (RθJA). This RθJA is valid only for the specific operating environment used in the computer model. Equation 5 simplifies into Equation 6: Rearranging Equation 6 gives Equation 7: Using Equation 6 and the computer model generated curves shown in Figure 25 and Figure 28, a designer can quickly compute the required heatsink thermal resistance/board area for a given ambient temperature, power dissipation, and operating environment. Figure 25. DDPAK Thermal Resistance vs Copper Heatsink Area The DDPAK package provides an effective means of managing power dissipation in surface mount applications. The DDPAK package dimensions are provided in the Mechanical Data section at the end of the data sheet. The addition of a copper plane directly underneath the DDPAK package enhances the thermal performance of the package. To illustrate, the TPS72525 in a DDPAK package was chosen. For this example, the average input voltage is 5V, the output voltage is 2.5V, the average output current is 1A, the ambient temperature 55 °C, the air flow is 150 LFM, and the operating environment is the same as documented below. Neglecting the quiescent current, the maximum Figure 26. DDPAK Thermal Resistance average power is calculated as Equation 8: From the data in Figure 27 and rearranging Substituting TJmax for TJ into Equation 6 gives Equation 6, the maximum power dissipation for a Equation 9: different ground plane area and a specific ambient temperature can be computed. 11 Submit Documentation Feedback |
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