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TPS79633KTTT Datasheet(PDF) 11 Page - Texas Instruments

No. de pieza TPS79633KTTT
Descripción Electrónicos  ULTRALOW-NOISE, HIGH PSRR, FAST, RF, 1A LOW-DROPOUT LINEAR REGULATORS
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RθJAmax + (125 * 55)°C 2.5 W + 28°C W (9)
T
J +
T
A )
P
Dmax x R
θJA
(6)
RθJA +
T
J–TA
P
Dmax
(7)
15
20
25
30
35
40
0.1
1
10
100
Copper Heatsink Area − cm2
No Air Flow
150 LFM
250 LFM
DDPAK Power Dissipation
1 oz. Copper
Power Plane
1 oz. Copper
Ground Plane
2 oz. Copper Solder Pad
with 25 Thermal Vias
Thermal Vias, 0.3 mm
Diameter, 1,5 mm Pitch
P
Dmax +
(5 * 2.5) V x 1 A + 2.5 W
(8)
TPS796xx
SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006
Even if no external black body radiator type heatsink
is attached to the package, the board on which the
regulator is mounted provides some heatsinking
From Figure 25, DDPAK Thermal Resistance vs
through the pin solder connections. Some packages,
Copper Heatsink Area, the ground plane needs to be
like the DDPAK and SOT223 packages, use a
1cm2 for the part to dissipate 2.5W. The operating
copper plane underneath the package or the circuit
environment used in the computer model to construct
board's ground plane for additional heatsinking to
Figure 25 consisted of a standard JEDEC High-K
improve their thermal performance. Computer-aided
board (2S2P) with a 1-oz. internal copper plane and
thermal modeling can be used to compute very
ground plane. The package is soldered to a 2-oz.
accurate approximations of an integrated circuit's
copper pad. The pad is tied through thermal vias to
thermal
performance
in
different
operating
the 1-oz. ground plane. Figure 26 shows the side
environments (e.g., different types of circuit boards,
view of the operating environment used in the
different types and sizes of heatsinks, and different
computer model.
air flows, etc.). Using these models, the three
thermal resistances can be combined into one
thermal resistance between junction and ambient
(RθJA). This RθJA is valid only for the specific
operating environment used in the computer model.
Equation 5 simplifies into Equation 6:
Rearranging Equation 6 gives Equation 7:
Using Equation 6 and the computer model generated
curves shown in Figure 25 and Figure 28, a designer
can quickly compute the required heatsink thermal
resistance/board
area
for
a
given
ambient
temperature,
power
dissipation,
and
operating
environment.
Figure 25. DDPAK Thermal Resistance vs Copper
Heatsink Area
The DDPAK package provides an effective means of
managing
power
dissipation
in
surface
mount
applications. The DDPAK package dimensions are
provided in the Mechanical Data section at the end
of the data sheet. The addition of a copper plane
directly underneath the DDPAK package enhances
the thermal performance of the package.
To illustrate, the TPS72525 in a DDPAK package
was chosen. For this example, the average input
voltage is 5V, the output voltage is 2.5V, the average
output current is 1A, the ambient temperature 55
°C,
the
air
flow
is
150
LFM,
and
the
operating
environment is the same as documented below.
Neglecting the quiescent current, the maximum
Figure 26. DDPAK Thermal Resistance
average power is calculated as Equation 8:
From
the
data
in
Figure
27
and
rearranging
Substituting TJmax for TJ into Equation 6 gives
Equation 6, the maximum power dissipation for a
Equation 9:
different ground plane area and a specific ambient
temperature can be computed.
11
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