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TPS79650DRBTG4 Datasheet(PDF) 10 Page - Texas Instruments |
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TPS79650DRBTG4 Datasheet(HTML) 10 Page - Texas Instruments |
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10 / 33 page  www.ti.com THERMAL INFORMATION T J + T A ) P Dmax x R θJC ) RθCS ) RθSA P D max + VIN(avg)* VOUT(avg) I OUT(avg))VIN(avg) I (Q) A B C TJ A RθJC TC B RθCS TA C RθSA (a) (b) DDPAK Package SOT223 Package CIRCUIT BOARD COPPER AREA B A C TPS796xx SLVS351I – SEPTEMBER 2002 – REVISED MAY 2006 dissipation. The temperature rise is computed by The amount of heat that an LDO linear regulator multiplying the maximum expected power dissipation generates is directly proportional to the amount of by the sum of the thermal resistances between the power it dissipates during operation. All integrated junction and the case (RθJC), the case to heatsink circuits have a maximum allowable junction (RθCS), and the heatsink to ambient (RθSA). Thermal temperature (TJmax) above which normal operation resistances are measures of how effectively an is not assured. A system designer must design the object dissipates heat. Typically, the larger the operating environment so that the operating junction device, the more surface area available for power temperature (TJ) does not exceed the maximum dissipation and the lower the object's thermal junction temperature (TJmax). The two main resistance. environmental variables that a designer can use to improve thermal performance are air flow and Figure 24 illustrates these thermal resistances for (a) external heatsinks. The purpose of this information is a SOT223 package mounted in a JEDEC low-K to aid the designer in determining the proper board, and (b) a DDPAK package mounted on a operating environment for a linear regulator that is JEDEC high-K board. operating at a specific power level. Equation 5 summarizes the computation: In general, the maximum expected power (PD(max)) consumed by a linear regulator is computed as Equation 4: (5) The RθJC is specific to each regulator as determined (4) by its package, lead frame, and die size provided in the regulator's data sheet. The RθSA is a function of where: the type and size of heatsink. For example, black • VIN(avg) is the average input voltage. body radiator type heatsinks can have RθCS values • VOUT(avg) is the average output voltage. ranging from 5 °C/W for very large heatsinks to 50 °C/W for very small heatsinks. The Rθ CS is a • IOUT(avg) is the average output current. function of how the package is attached to the • I(Q) is the quiescent current. heatsink. For example, if a thermal compound is For most TI LDO regulators, the quiescent current is used to attach a heatsink to a SOT223 package, insignificant compared to the average output current; RθCS of 1°C/W is reasonable. therefore, the term VIN(avg) × I(Q) can be neglected. The operating junction temperature is computed by adding the ambient temperature (TA) and the increase in temperature due to the regulator's power Figure 24. Thermal Resistances 10 Submit Documentation Feedback |
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