PI3041A datasheet(3/18 Pages) AMI

No. de pieza	PI3041A

Descripción Electrónicos	Contact Image Sensor 300DPI CIS Sensor Chip

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Fabricante Electrónico	AMI [AMI SEMICONDUCTOR]

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Preliminary PI3041A datasheet

Bonding Pad Outputs Locations and Die Dimensions

Figure 2 shows image sensor’s die dimension and the bonding pad locations for PI3041A Sensor Chip. The location is

referenced to the lower left corner of the die.

Figure 2. Bonding Pad and Chip Layout:

Page 3 of 18 Date: 09/23/05

Número de pieza similar - PI3041A

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
AMI SEMICONDUCTOR	PI3042A	1Mb / 18P	Contact Image Sensor Chip

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