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TC4423CMF Datasheet(PDF) 3 Page - Microchip Technology |
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TC4423CMF Datasheet(HTML) 3 Page - Microchip Technology |
3 / 18 page 2004 Microchip Technology Inc. DS21421D-page 3 TC4423/TC4424/TC4425 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage ................................................................+22V Input Voltage, IN A or IN B ................................................ (VDD + 0.3V) to (GND – 5V) Package Power Dissipation (TA ≤ 70°C) DFN ......................................................................... Note 2 PDIP .......................................................................730 mW SOIC.......................................................................470 mW † Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, TA = +25°C, with 4.5V ≤ VDD ≤ 18V. Parameters Sym Min Typ Max Units Conditions Input Logic ‘1’, High Input Voltage VIH 2.4 — — V Logic ‘0’, Low Input Voltage VIL —— 0.8 V Input Current IIN –1 — 1 µA 0V ≤ V IN ≤ VDD Output High Output Voltage VOH VDD – 0.025 — — V Low Output Voltage VOL — — 0.025 V Output Resistance, High ROH —2.8 5 Ω IOUT = 10 mA, VDD = 18V Output Resistance, Low ROL —3.5 5 Ω IOUT = 10 mA, VDD = 18V Peak Output Current IPK —3 — A Latch-Up Protection With- stand Reverse Current IREV — >1.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec. Switching Time (Note 1) Rise Time tR —23 35 ns Figure 4-1, Figure 4-2, CL = 1800 pF Fall Time tF —25 35 ns Figure 4-1, Figure 4-2, CL = 1800 pF Delay Time tD1 —33 75 ns Figure 4-1, Figure 4-2, CL = 1800 pF Delay Time tD2 —38 75 ns Figure 4-1, Figure 4-2, CL = 1800 pF Power Supply Power Supply Current IS — — 1.5 0.15 2.5 0.25 mA VIN = 3V (Both inputs) VIN = 0V (Both inputs) Note 1: Switching times ensured by design. 2: Package power dissipation is dependent on the copper pad area on the PCB. |
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