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TPS650242RHB Datasheet(PDF) 2 Page - Texas Instruments |
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TPS650242RHB Datasheet(HTML) 2 Page - Texas Instruments |
2 / 34 page www.ti.com ABSOLUTE MAXIMUM RATINGS DISSIPATION RATINGS TPS650240 TPS650241 TPS650242 SLVS774 – JUNE 2007 These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. ORDERING INFORMATION TA VOLTAGE AT output current on DCDC1 / VOLTAGE AT PACKAGE PART NUMBER(1) DCDC3 DCDC2 / DCDC3 VDD_ALIVE 1.0 V / 1.3 V 1.0 A / 0.8 A / 0.8 A 1.2 V TPS650240RHB –40 °C to 32 pin QFN 0.9 V / 1.375 V 1.6 A / 1.0 A / 0.8 A 1.2 V TPS650241RHB 85 °C (RHB) 1.0 V / 1.5 V 1.0 A / 0.8 A / 0.8 A 1.2 V TPS650242RHB (1) The RHB package is available in tape and reel. Add R suffix (TPS650240RHBR) to order quantities of 3000 parts per reel. Add T suffix (TPS650240RHBT) to order quantities of 250 parts per reel. over operating free-air temperature range (unless otherwise noted) (1) VALUE UNIT Input voltage range on all pins except A/PGND pins with respect to AGND –0.3 to 7 V Current at VINDCDC1, L1, PGND1, VINDCDC2, L2, PGND2, VINDCDC3, L3, PGND3 2000 mA Peak Current at all other pins 1000 mA Continuous total power dissipation See Dissipation Rating Table TA Operating free-air temperature –40 to 85 °C TJ Maximum junction temperature 125 °C Tst Storage temperature –65 to 150 °C Lead temperature 1,6 mm (1/16-inch) from case for 10 seconds 260 °C (1) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. TA ≤ 25°C DERATING FACTOR TA = 70°C TA = 85°C PACKAGE(1) RθJA POWER RATING ABOVE TA = 25°C POWER RATING POWER RATING RHB 35K/W 2.85W 28mW/K 1.57W 1.14W (1) The thermal resistance junction to ambient of the RHB package is measured on a high K board. The thermal resistance junction to power pad is 1.5K/W. 2 Submit Documentation Feedback |
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