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AMC76385-X.XSKF Datasheet(PDF) 6 Page - ADDtek Corp |
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AMC76385-X.XSKF Datasheet(HTML) 6 Page - ADDtek Corp |
6 / 8 page AMC7638 Copyright © 2007 ADDtek Corp. 6 DD054_N -- MAY 2007 APPLICATION INFORMATION The maximum power dissipation of a single-output regulator PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ VOUT(NOM) = the nominal output voltage IOUT(NOM) = the nominal output current, and IQ = the quiescent current the regulator consumes at IOUT(MAX) VIN(MAX) = the maximum input voltage Thermal consideration The AMC7638 series have internal power and thermal limiting circuitry designed to protect the device under overload conditions. However maximum junction temperature ratings should not be exceeded under continuous normal load conditions. The thermal protection circuit of AMC7638 series will prevent the device from damage due to excessive power dissipation. When the device temperature rises to approximately 150 OC, the regulator will be turned off. When power consumption is over about 775mW (SOT89 package, at TA=70 OC), additional heat sink is required to control the junction temperature below 125 OC. The junction temperature is: TJ = PD (θJT + θCS + θSA ) + TA P D:Dissipated power. θJT:Thermal resistance from the junction to the mounting tab of the package. θCS:Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically, θCS < 1.0OC /W) θSA:Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink). If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with several through hole vias. PCB θSA(OC /W ) 59 45 38 33 27 24 21 PCB heat sink size (mm2) 500 1000 1500 2000 3000 4000 5000 Recommended figure of PCB area used as a heat sink. (Top View) (Bottom View) through hole vias |
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