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AMMP-6222-TR2G Datasheet(PDF) 11 Page - AVAGO TECHNOLOGIES LIMITED

No. de pieza AMMP-6222-TR2G
Descripción Electrónicos  7 to 21 GHz GaAs High Linearity LNA in SMT Package
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Fabricante Electrónico  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Página de inicio  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

AMMP-6222-TR2G Datasheet(HTML) 11 Page - AVAGO TECHNOLOGIES LIMITED

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Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
Manual Assembly
• Follow ESD precautions while handling packages.
• Handling should be along the edges with tweezers.
• Recommended attachment is conductive solder paste.
Please see recommended solder reflow profile. Neither
Conductive epoxy or hand soldering is recommended.
• Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
• Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temp. to avoid damage
due to thermal shock.
• Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Peak = 250 ± 5˚C
Ramp 1 Preheat Ramp 2 Reflow
Cooling
Melting point = 218˚C
A properly designed solder screen or stencil is required to
ensure optimum amount of solder paste is deposited onto
the PCB pads. The recommended stencil layout is shown
in Figure 23. The stencil has a solder paste deposition
opening approximately 70% to 90% of the PCB pad.
Reducing stencil opening can potentially generate more
voids underneath. On the other hand, stencil openings
larger than 100% will lead to excessive solder paste smear
or bridging across the I/O pads. Considering the fact that
solder paste thickness will directly affect the quality of
the solder joint, a good choice is to use a laser cut stencil
composed of 0.127mm (5 mils) thick stainless steel which
is capable of producing the required fine stencil outline.
The most commonly used solder reflow method is
accomplished in a belt furnace using convection heat
transfer.The suggested reflow profile for automated reflow
processes is shown in Figure 24. This profile is designed
to ensure reliable finished joints. However, the profile
indicated in Figure 14 will vary among different solder
pastes from different manufacturers and is shown here for
reference only.
Package, Tape & Reel, and Ordering Information
AMMP-6222 Part Number Ordering Information
Part Number
Devices Per Container
Container
AMMP-6222-BLKG
0
Antistatic bag
AMMP-6222-TRG
00
7”Reel
AMMP-6222-TR2G
500
7”Reel


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