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AMMC-6420 Datasheet(PDF) 5 Page - AVAGO TECHNOLOGIES LIMITED

No. de pieza AMMC-6420
Descripción Electrónicos  86 - 18 GHz Power Amplifier
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Fabricante Electrónico  AVAGO [AVAGO TECHNOLOGIES LIMITED]
Página de inicio  http://www.avagotech.com
Logo AVAGO - AVAGO TECHNOLOGIES LIMITED

AMMC-6420 Datasheet(HTML) 5 Page - AVAGO TECHNOLOGIES LIMITED

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5
Biasing and Operation
TherecommendedquiescentDCbiasconditionforop-
timumefficiency,performance,andreliabilityisVd=5.5
voltswithVgsetforId=800mA.Minorimprovementsin
performancearepossibledependingontheapplication.
Thedrainbiasvoltagerangeis3to5.5V.AsingleDCgate
supplyconnectedtoVgwillbiasallgainstages.Muting
canbeaccomplishedbysettingVgtothepinch-offvolt-
ageVp(-1.0V).
An optional output power detector network is also
provided.The differential voltage between the Det-Ref
andDet-OutpadscanbecorrelatedwiththeRFpower
emergingfromtheRFoutputport.Thedetectedvoltage
isgivenby:
(
)
ofs
ref
V
V
V
V
=
det
where ref
V isthevoltageatthe
R
DET _ port, det
V isavoltage
atthe
O
DET _ port,and ofs
V isthezero-input-poweroffset
voltage.Therearethreemethodstocalculate:
1. ofs
V canbemeasuredbeforeeachdetectormeasure-
ment(byremovingorswitchingoffthepowersource
andmeasuring).Thismethodgivesanerrordueto
temperaturedriftoflessthan0.01dB/50°C.
2. ofs
V canbemeasuredatasinglereferencetemperature.
Thedrifterrorwillbelessthan0.25dB.
3. ofs
V caneitherbecharacterizedovertemperatureand
storedinalookuptable,oritcanbemeasuredattwo
temperaturesandalinearfitusedtocalculateatany
temperature.Thismethodgivesanerrorclosetothe
method#1.
TheRFportsareACcoupledattheRFinputtothefirststage
andtheRFoutputofthefinalstage.Nogroundwiresare
neededsincegroundconnectionsaremadewithplated
through-holestothebacksideofthedevice.
Assembly Techniques
ThebacksideoftheMMICchipisRFground.Formicrostrip
applicationsthechipshouldbeattacheddirectlytothe
groundplane(e.g.circuitcarrierorheatsink)usingelectri-
callyconductiveepoxy[1]
Forbestperformance,thetopsideoftheMMICshouldbe
broughtuptothesameheightasthecircuitsurrounding
it.This can be accomplished by mounting a gold plate
metalshim(samelengthandwidthastheMMIC)under
thechipwhichisofcorrectthicknesstomakethechip
and adjacent circuit the same height. The amount of
epoxyusedforthechipand/orshimattachmentshould
bejustenoughtoprovideathinfilletaroundthebottom
perimeterofthechiporshim.Thegroundplainshould
befreeofanyresiduethatmayjeopardizeelectricalor
mechanicalattachment.
ThelocationoftheRFbondpadsisshowninFigure12.
NotethatalltheRFinputandoutputportsareinaGround-
Signal-Groundconfiguration.
RFconnectionsshouldbekeptasshortasreasonableto
minimize performance degradation due to undesirable
seriesinductance.Asinglebondwireisnormallysufficient
forsignalconnections,howeverdoublebondingwith0.7
milgoldwireoruseofgoldmesh[2]isrecommended
forbestperformance,especiallynearthehighendofthe
frequencyband.
Thermosonicwedgebondingispreferredmethodforwire
attachmenttothebondpads.Goldmeshcanbeattached
usinga2milroundtrackingtoolandatoolforceofap-
proximately22gramsandaultrasonicpowerofroughly
55dBforadurationof76+/-8mS.Theguidedwedgeat
anuntrasonicpowerlevelof64dBcanbeusedfor0.7mil
wire.Therecommendedwirebondstagetemperatureis
150+/-2C.
CautionshouldbetakentonotexceedtheAbsoluteMaxi-
mumRatingforassemblytemperatureandtime.
Thechipis100umthickandshouldbehandledwithcare.
ThisMMIChasexposedairbridgesonthetopsurfaceand
shouldbehandledbytheedgesorwithacustomcollet
(donotpickupthediewithavacuumondiecenter).
This MMIC is also static sensitive and ESD precautions
shouldbetaken.
Notes:
[1] Ablebond84-1LM1silverepoxyisrecommended.
[2] Buckbee-MearsCorporation,St.Paul,MN,800-262-3824


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