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DEVICE INFORMATION

V

SDd

V

DD

RGP (QFN)Package

(TopView)

TPA2013D1RGP

2

5

7

10

11

14

17

20

GAIN

AGND

VOUT–

VOUT–

VOUT+

VOUT+

VOUT+

V

SW

V

V

SDb

IN+

IN–

PGND

AGND

SDd

PGND

VOUT–

V

DD

GAIN

VOUT+

PGND

D1

D2

D3

D4

C1

C2

C3

C4

B1

B3

B4

B2

A1

A2

A3

A4

YZH (WCSP)Package

(TopView)

TPA2013D1YZH

18

19

16

13

12

15

3

4

1

8

9

6

TPA2013D1

SLOS520 – AUGUST 2007

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

BOOST CONVERTER TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

QFN

WCSP

IN+

8

D2

I

Positive audio input

IN–

7

D3

I

Negative audio input

VOUT+

13, 14, 15

B1

O

Positive audio output

VOUT–

11, 12

C1

O

Negative audio output

SDb

6

D4

I

Shutdown terminal for the Boost Converter

SDd

5

C3

I

Shutdown terminal for the Class D Amplifier

SW

18, 19

A3

–

Boost and rectifying switch input

17

A2

–

GAIN

3

B2

I

Gain selection pin

16

A1

–

2

B3

I

Voltage feedback

1

B4

–

Supply voltage

AGND

4

C4

–

Analog ground - connect all GND pins together

PGND

9, 10, 20

D1, C2, A4

–

Power ground - connect all GND pins together

Thermal

Solder the thermal pad on the bottom of the QFN package to the GND plane of the PCB.

Die Pad

N/A

P

Pad

It is required for mechanical stability and will enhance thermal performance.

2

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Copyright © 2007, Texas Instruments Incorporated

Product Folder Link(s): TPA2013D1