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NE555 Datasheet(PDF) 3 Page - Texas Instruments |
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NE555 Datasheet(HTML) 3 Page - Texas Instruments |
3 / 15 page SLFS022 – D1669, SEPTEMBER 1973—REVISED FEBRUARY 1992 NE555Y PRECISION TIMERS POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 chip information These chips, properly assembled, display characteristics similar to the NE555 (see electrical table for NE555Y). Thermal compression or ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive epoxy or a gold-silicon preform. GND RESET (4) CONT VCC (8) 1 THRES TRIG R R R DISCH OUT S R R1 CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJ max = 150° C TOLERANCES ARE ± 10% ALL DIMENSIONS ARE IN MILS PIN (1) INTERNALLY CONNECTED TO BACKSIDE OF CHIP (5) (6) (2) (1) (7) (3) BONDING PAD ASSIGNMENTS 41 42 (1) (2) (3) (4) (8) (7) (6) (5) |
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