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SN74CBTLV3253DG4 Datasheet(PDF) 3 Page - Texas Instruments

No. de pieza SN74CBTLV3253DG4
Descripción Electrónicos  LOW-VOLTAGE DUAL 1-OF-4 FET MULTIPLEXER/DEMULTIPLEXER
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
Logo TI - Texas Instruments

SN74CBTLV3253DG4 Datasheet(HTML) 3 Page - Texas Instruments

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SN74CBTLV3253
LOW VOLTAGE DUAL 1OF4 FET MULTIPLEXER/DEMULTIPLEXER
SCDS039H − DECEMBER 1997 − REVISED OCTOBER 2003
3
POST OFFICE BOX 655303
DALLAS, TEXAS 75265
simplified schematic, each FET switch
A
(OE)
B
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, VCC
−0.5 V to 4.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1)
−0.5 V to 4.6 V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous channel current
128 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI/O < 0)
−50 mA
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package thermal impedance,
θJA (see Note 2): D package
73
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DBQ package
90
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): DGV package
120
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 2): PW package
108
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
(see Note 3): RGY package
39
°C/W
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg
−65
°C to 150°C
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES:
1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
2. The package thermal impedance is calculated in accordance with JESD 51-7.
3. The package thermal impedance is calculated in accordance with JESD 51-5.
recommended operating conditions (see Note 4)
MIN
MAX
UNIT
VCC
Supply voltage
2.3
3.6
V
VIH
High-level control input voltage
VCC = 2.3 V to 2.7 V
1.7
V
VIH
High-level control input voltage
VCC = 2.7 V to 3.6 V
2
V
VIL
Low-level control input voltage
VCC = 2.3 V to 2.7 V
0.7
V
VIL
Low-level control input voltage
VCC = 2.7 V to 3.6 V
0.8
V
TA
Operating free-air temperature
−40
85
°C
NOTE 4: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.


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