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FMA3011 Datasheet(PDF) 9 Page - Filtronic Compound Semiconductors

No. de pieza FMA3011
Descripción Electrónicos  12.7-16GHZ MMIC POWER AMPLIFIER
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Fabricante Electrónico  FILTRONIC [Filtronic Compound Semiconductors]
Página de inicio  http://www.filtronic.co.uk/
Logo FILTRONIC - Filtronic Compound Semiconductors

FMA3011 Datasheet(HTML) 9 Page - Filtronic Compound Semiconductors

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Specifications subject to change without notice
Filtronic Compound Semiconductors Ltd
Tel: +44 (0) 1325 301111
Fax: +44 (0) 1325 306177
Email: sales@filcs.com
Website: www.filtronic.com
9
Datasheet v4.0
FMA3011
PREFERRED ASSEMBLY INSTRUCTIONS:
GaAs devices are fragile and should be
handled with great care. Specially designed
collets should be used where possible.
The back of the die is metallised and the
recommended mounting method is by the use
of conductive epoxy or solder. If Conductive
Epoxy is used it should be applied to the
attachment surface uniformly and sparingly to
avoid encroachment of epoxy on to the top
face of the die and ideally should not exceed
half the chip height.
For automated and
manual
dispense
Ablebond
8350M
is
recommended. Ablestick 84-1 can be used as
an alternative. These should be cured at a
temperature of 150
°C for 1 hour in an oven
especially set aside for epoxy curing only. If
possible the curing oven should be flushed
with dry nitrogen.
This part has gold (Au) bond pads requiring
the use of gold (99.99% pure) bondwire. It is
recommended that 25.4
µm diameter gold wire
is used. For thermosonic ball bonding a
nominal stage temperature of 150
°C and a
bonding force of 40g has been shown to give
effective results for 25
µm wire.
Ultrasonic
energy shall be kept to a minimum. For this
bonding technique, stage temperature should
not be raised above 200°C and bond force
should not be raised above 60g. Thermosonic
wedge
bonding
and
thermocompression
wedge bonding can also be used to achieve
good wire bonds.
Bonds should be made from the die first and
then to the mounting substrate or package.
The physical length of the bondwires should be
minimised especially when making RF or
ground connections.
HANDLING
PRECAUTIONS:
To avoid damage to the devices care should
be
exercised
during
handling.
Proper
Electrostatic
Discharge
(ESD)
precautions
should be observed at all stages of storage,
handling,
assembly,
and
testing.
These
devices should be treated as Class 0 (0-250 V)
as defined in JEDEC Standard No. 22-A114.
Further information on ESD control measures
can be found in MIL-STD-1686 and MIL-
HDBK-263.
APPLICATION NOTES & DESIGN DATA:
Application Notes and design data including S-
parameters,
noise
data
and
large-signal
models are available on request.
DISCLAIMERS:
This product is not designed for use in any
space
based
or
life
sustaining/supporting
equipment.
ORDERING INFORMATION:
PART NUMBER
DESCRIPTION
FMA3011
Die in Waffle-pack
(Gel-pak available on request)


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