Pin

#

Label

Circuit

Pin ESD Protection Structure Circuits

1

D1+

A

Circuit A

Circuit B

Circuit C

2

D1−

A

3

D2+

A

4

D2−

A

5

GND

B

6V

DD

B

7

SMBDAT

C

8

SMBCLK

C

Note 3: Thermal resistance junction-to-ambient when attached to a printed circuit board with 1oz. foil and no airflow:

– MSOP-8 = 210˚C/W

Note 4: Human body model, 100pF discharged through a 1.5k

Ω resistor. Machine model, 200pF discharged directly into each pin.

Note 5: Reflow temperature profiles are different for packages containing lead (Pb) than for those that do not.

Note 7: Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).

Note 8: Local temperature accuracy does not include the effects of self-heating. The rise in temperature due to self-heating is the product of the internal power

dissipation of the LM95231 and the thermal resistance. See (Note 3) for the thermal resistance to be used in the self-heating calculation.

Note 9: The accuracy of the LM95231 is guaranteed when using the thermal diode of Pentium 4 processor on 90nm process or an MMBT3904 type transistor, as

selected in the Remote Diode Model Select register.

Note 10: Quiescent current will not increase substantially when the SMBus is active.

Note 11: This specification is provided only to indicate how often temperature data is updated. The LM95231 can be read at any time without regard to conversion

state (and will yield last conversion result).

SMBDAT and SMBCLK pins to a high impedance state.

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