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OP250GBC Datasheet(PDF) 4 Page - Analog Devices

No. de pieza OP250GBC
Descripción Electrónicos  CMOS Single-Supply Rail-to-Rail Input/Output Operational Amplifier
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OP250GBC Datasheet(HTML) 4 Page - Analog Devices

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OP150/OP250/OP450
This information applies to a product under development. Its characteristics and specifications are subject to change without notice.
Analog Devices assumes no obligation regarding future manufacture unless otherwise agreed to in writing.
REV. 0
PRELIMINARY TECHNICAL DATA
–4–
WARNING!
ESD SENSITIVE DEVICE
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the OP150/OP250/OP450 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore, p roper
ESD precautions are recommended to avoid performance degradation or loss of functionality.
WAFER TEST LIMITS
Parameter
Symbol
Conditions
Limit
Units
Offset Voltage
VOS
±10
mV max
Input Bias Current
IB
50
pA max
Input Offset Current
IOS
10
pA max
Input Voltage Range
VCM
V– to V+
V min
Common-Mode Rejection Ratio
CMRR
VCM = 0 V to 10 V
60
dB min
Power Supply Rejection Ratio
PSRR
V = +2.7 V to +7 V
70
dB min
Large Signal Voltage Gain
AVO
RL = 10 k
V/mV min
Output Voltage High
VOH
RL = 2 kΩ to GND
2.9
V min
Output Voltage Low
VOL
RL = 2 k
Ω to V+
55
mV max
Supply Current/Amplifier
ISY
VO = 0 V, RL =
650
µA max
NOTE
Electrical tests and wafer probe to the limits shown. Due to variations in assembly methods and normal yield loss, yield after packaging is not guaranteed for standard
product dice. Consult factory to negotiate specifications based on dice lot qualifications through sample lot assembly and testing.
(@ VS = +5.0 V, VCM = 0 V, TA = +25 C unless otherwise noted.)
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7 V
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Output Short-Circuit Duration to GND
2
. . . . . . . . . Indefinite
Storage Temperature Range
P, S, RT, RU Package . . . . . . . . . . . . . . . . –65
°C to +150°C
Operating Temperature Range
OP150/OP250/OP450G . . . . . . . . . . . . . . . –40
°C to +125°C
Junction Temperature Range
P, S, RT, RU Package . . . . . . . . . . . . . . . . –65
°C to +150°C
Lead Temperature Range (Soldering, 60 sec) . . . . . . . +300
°C
Package Type
θ
JA
3
θ
JC
Units
5-Pin SOT (RT)
325
°C/W
8-Pin Plastic DIP (P)
103
43
°C/W
8-Pin SOIC (S)
158
43
°C/W
8-Pin TSSOP (RU)
240
43
°C/W
14-Pin Plastic DIP (P)
76
33
°C/W
14-Pin SOIC (S)
120
36
°C/W
14-Pin TSSOP( RU)
180
35
°C/W
NOTES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2
θ
JA is specified for the worst case conditions, i.e., θJA is specified for device in
socket for P-DIP packages;
θ
JA is specified for device soldered in circuit board
for SOIC package.
ORDERING GUIDE
Temperature
Model
Range
Package Option
OP150GS
–40
°C to +125°C
8-Pin SOIC
OP150GRT
–40
°C to +125°C
5-Pin SOT
OP150GBC
+25
°C
DICE
OP250GP
–40
°C to +125°C
8-Pin Plastic DIP
OP250GS
–40
°C to +125°C
8-Pin SOIC
OP250GRU
–40
°C to +125°C
8-Pin TSSOP
OP250GBC
+25
°C
DICE
OP450GP
–40
°C to +125°C
14-Pin Plastic DIP
OP450GS
–40
°C to +125°C
14-Pin SOIC
OP450GRU
–40
°C to +125°C
14-Pin TSSOP
OP450GBC
+25
°C
DICE
OBSOLETE


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