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TPS78625DCQG4 Datasheet(PDF) 10 Page - Texas Instruments

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No. de pieza TPS78625DCQG4
Descripción Electrónicos  ULTRALOW-NOISE, HIGH-PSRR, FAST, RF, 1.5-A LOW-DROPOUT LINEAR REGULATORS
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Fabricante Electrónico  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS78625DCQG4 Datasheet(HTML) 10 Page - Texas Instruments

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THERMAL INFORMATION
T
J + TA ) PDmax
R
qJC )
R
qCS )
R
qSA
(5)
P
D max
+ VIN(avg) * VOUT(avg)
I
OUT(avg) ) VIN(avg)
I
Q
A
B
C
TJ
A
RθJC
TC
B
RθCS
TA
C
RθSA
(a)
(b)
DDPAK Package
SOT223 Package
CIRCUIT BOARD COPPER AREA
B
A
C
TPS786xx
SLVS389G – SEPTEMBER 2002 – REVISED JULY 2006
increase in temperature due to the regulator power
The amount of heat that an LDO linear regulator
dissipation. The temperature rise is computed by
generates is directly proportional to the amount of
multiplying the maximum expected power dissipation
power it dissipates during operation. All integrated
by the sum of the thermal resistances between the
circuits
have
a
maximum
allowable
junction
junction and the case (RθJC), the case to heatsink
temperature (TJmax) above which normal operation
(RθCS), and the heatsink to ambient (RθSA). Thermal
is not assured. A system designer must design the
resistances are measures of how effectively an
operating environment so that the operating junction
object dissipates heat. Typically, the larger the
temperature (TJ) does not exceed the maximum
device, the more surface area available for power
junction
temperature
(TJmax).
The
two
main
dissipation and the lower the object's thermal
environmental variables that a designer can use to
resistance.
improve thermal performance are air flow and
external heatsinks. The purpose of this information is
Figure 26 illustrates these thermal resistances for (a)
to aid the designer in determining the proper
a SOT223 package mounted in a JEDEC low-K
operating environment for a linear regulator that is
board, and (b) a DDPAK package mounted on a
operating at a specific power level.
JEDEC high-K board.
In general, the maximum expected power (PDmax)
Equation 5 summarizes the computation:
consumed by a linear regulator is computed as
shown in Equation 4:
The RθJC is specific to each regulator as determined
by its package, lead frame, and die size provided in
(4)
the regulator data sheet. The RθSA is a function of
where:
the type and size of heatsink. For example, black
body radiator type heatsinks can have RθCS values
• V
IN(avg) is the average input voltage.
ranging from 5
°C/W for very large heatsinks to
• V
OUT(avg) is the average output voltage.
50
°C/W for very small heatsinks. The Rθ
CS
is a
• I
OUT(avg) is the average output current.
function of how the package is attached to the
• I
Q is the quiescent current.
heatsink. For example, if a thermal compound is
used to attach a heatsink to a SOT223 package,
For most TI LDO regulators, the quiescent current is
RθCS of 1°C/W is reasonable.
insignificant compared to the average output current;
therefore, the term VIN(avg)× IQ can be neglected. The
operating junction temperature is computed by
adding
the
ambient
temperature
(TA) and the
Figure 26. Thermal Resistances
10
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