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ST62T52CM-AUTO Datasheet(PDF) 68 Page - STMicroelectronics

No. de Pieza. ST62T52CM-AUTO
Descripción  8-BIT OTP/EPROM/FASTROM MCUs WITH A/D CONVERTER, SAFE RESET, AUTO-RELOAD TIMER AND EEPROM
Descarga  72 Pages
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Fabricante  STMICROELECTRONICS [STMicroelectronics]
Página de inicio  http://www.st.com
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ST62T52CM-AUTO Datasheet(HTML) 68 Page - STMicroelectronics

 
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ST62T52CM-Auto ST62T62CM-Auto
THERMAL CHARACTERISTICS
7.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
® .
ECOPACK
® packages are qualified according
to the JEDEC STD-020B compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
® transition program is available on
www.st.com/stonline/leadfree/,
with
specific
technical application notes covering the main
technical
aspects
related
to
lead-free
conversion
(AN2033,
AN2034,
AN2035,
AN2036).
Forward compatibility
ECOPACK
® LQFP packages are fully compatible
with lead (Pb) containing soldering process (see
application note AN2034).
Table 22. Soldering Compatibility (Wave and Reflow Soldering Process)
7.3 OTP/EPROM VERSION ORDERING INFORMATION
Table 23. OTP/EPROM VERSION ORDERING INFORMATION
7.4 IMPORTANT NOTE
For OTP devices, data retention and programmability must be guaranteed by a screening procedure. Re-
fer to Application Note AN886.
Symbol
Parameter
Test Conditions
Value
Unit
Min.
Typ.
Max.
RthJA
Thermal Resistance
SO16
75
°C/W
Package
Plating Material Devices
Pb Solder Paste
Pb-free Solder Paste
SO16
NiPdAu
Yes
Yes
Sales Type
Program
Memory (Bytes)
EEPROM (Bytes)
Temperature Range
Package
ST62E62CF1
1836 EPROM
64
0 to +70°C
CDIP16W
ST62T62CMA
1836 OTP
64
-40 to + 85°C
SO16
ST62T62CMC
-40 to + 125°C
ST62T52CMA
1836 OTP
None
-40 to + 85°C
ST62T52CMC
-40 to + 125°C


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