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ST62T08CB6 Datasheet(PDF) 92 Page - STMicroelectronics |
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ST62T08CB6 Datasheet(HTML) 92 Page - STMicroelectronics |
92 / 104 page ST6208C/ST6209C/ST6210C/ST6220C 92/104 11.2 THERMAL CHARACTERISTICS Notes: 1. The power dissipation is obtained from the formula PD = PINT + PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation determined by the user. 2. The average chip-junction temperature can be obtained from the formula TJ = TA + PD x RthJA. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) DIP20 SO20 SSOP20 60 80 115 °C/W PD Power dissipation 1) 500 mW TJmax Maximum junction temperature 2) 150 °C 1 |
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