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TLPXXM Datasheet(PDF) 14 Page - STMicroelectronics |
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TLPXXM Datasheet(HTML) 14 Page - STMicroelectronics |
14 / 14 page Printed circuit board material Rth (j-a) P Diss 1.FR4 using the recommended pad-layout 50 °C/W 1.5 W 2.FR4 with heatsink on board (6cm 2)35 °C/W 2.0 W 3.FR4 with copper-filled through holes and external heatsink applied 12 °C/W 5.8 W 4. IMS floating in air (40 cm 2)8 °C/W 8.8 W 5. IMS with external heatsink applied 3.5 °C/W 20 W TABLE 1 A new technologyavailable today is IMS - an Insu- lated Metallic Substrate. This offers greatly en- hanced thermal characteristics for surface mount components. IMS is a substrate consisting of three different layers, (I) the base material which is available as an aluminium or a copper plate, (II) a thermal conductive dielectrical layer and (III) a copper foil, which can be etched as a circuit layer. Using this material a thermal resistance of 8 °C/W with 40 cm 2 of board floating in air is achievable (see fig. 4). If even higher power is to be dissipated an external heatsink could be applied which leads to an Rth(j-a) of 3.5 °C/W (see Fig. 5), assuming that Rth (heatsink-air) is equal to Rth (junction- heatsink). This is commonly applied in practice, leading to reasonable heatsink dimensions. Often power devices are defined by considering the maximum junction temperature of the device. In practice , however, this is far from being exploited. A summary of various power management capa- bilities is made in table 1 based on a reasonable delta T of 70 °C junction to air. The PowerSO-10 concept also represents an attractive alternative to C.O.B. techniques. PowerSO-10 offers devices fully tested at low and high temperature. Mounting is simple - only conventional SMT is required - enabling the users to get rid of bond wire problems and the problem to control the high temperature soft soldering as well. An optimized thermal management is guaranteed through PowerSO-10 as the power chips must in any case be mounted on heat spreaders before being mounted onto the substrate. Fig. 4 : Mounting on metal backed board Fig. 5 : Mounting on metal backed board with an external heatsink applied FR4 board Copper foil Aluminium heatsink Copper foil Insulation Aluminium Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap- proval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics © 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands - Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. http://www.st.com TLPxxM/G/G-1 14/14 |
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