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MC10XS3412 Datasheet(PDF) 5 Page - Freescale Semiconductor, Inc |
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MC10XS3412 Datasheet(HTML) 5 Page - Freescale Semiconductor, Inc |
5 / 51 page Analog Integrated Circuit Device Data Freescale Semiconductor 5 10XS3412 ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS ELECTRICAL CHARACTERISTICS MAXIMUM RATINGS Table 2. Maximum Ratings All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage to the device. Ratings Symbol Value Unit ELECTRICAL RATINGS VPWR Supply Voltage Range Load Dump at 25°C (400ms) Maximum Operating Voltage Reverse Battery at 25°C (2 min.) VPWR(SS) 41 28 -18 V VDD Supply Voltage Range VDD -0.3 to 5.5 V Input/Output Voltage (4) -0.3 to VDD+0.3 V WAKE Input Clamp Current ICL(WAKE) 2.5 mA CSNS Input Clamp Current ICL(CSNS) 2.5 mA HS [0:3] Voltage Positive Negative VHS[0:3] 41 -16 V Output Current(1) IHS[0:3] 6 A Output Clamp Energy Using Single-Pulse Method(2) ECL[0:3] 100 mJ ESD Voltage(3) Human Body Model (HBM) for HS[0:3], VPWR and GND Human Body Model (HBM) for other pins Charge Device Model (CDM) Corner Pins (1, 13, 19, 21) All Other Pins (2-12, 14-18, 20, 22-24) VESD1 VESD2 VESD3 VESD4 ±8000 ±2000 ±750 ±500 V THERMAL RATINGS Operating Temperature Ambient Junction TA TJ -40 to 125 -40 to 150 °C Storage Temperature TSTG -55 to 150 °C Notes 1. Continuous high side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output current using package thermal resistance is required. 2. Active clamp energy using single-pulse method (L = 2mH, RL = 0Ω, VPWR = 14V, TJ = 150°C initial). 3. ESD testing is performed in accordance with the Human Body Model (HBM) (CZAP = 100pF, RZAP = 1500Ω), the Machine Model (MM) (CZAP = 200pF, RZAP = 0Ω), and the Charge Device Model (CDM), Robotic (CZAP = 4.0pF). 4. Input / Output pins are: IN[0:3], RSTB, FSI, CSNS, SI, SCLK, CSB, SO, FSB |
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