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SMF05 Datasheet(PDF) 5 Page - Semtech Corporation |
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SMF05 Datasheet(HTML) 5 Page - Semtech Corporation |
5 / 8 page 5 2008 Semtech Corp. www.semtech.com PROTECTION PRODUCTS SMF05 and SMF12 SMF Circuit Diagram Protection of Four Unidirectional Lines Device Connection for Protection of Four Data Lines The SMFxx is designed to protect up to four unidirec- tional data lines. The device is connected as follows: 1. Unidirectional protection of four I/O lines is achieved by connecting pins 1, 3, 4, and 5 to the data lines. Pin 2 is connected to ground. The ground connection should be made directly to the ground plane for best results. The path length is kept as short as possible to reduce the effects of parasitic inductance in the board traces. Circuit Board Layout Recommendations for Suppres- sion of ESD. Good circuit board layout is critical for the suppression of ESD induced transients. The following guidelines are recommended: Place the SMFxx near the input terminals or con- nectors to restrict transient coupling. Minimize the path length between the SMFxx and the protected line. Minimize all conductive loops including power and ground loops. The ESD transient return path to ground should be kept as short as possible. Never run critical signals near board edges. Use ground planes whenever possible. Matte Tin Lead Finish Matte tin has become the industry standard lead-free replacement for SnPb lead finishes. A matte tin finish is composed of 100% tin solder with large grains. Since the solder volume on the leads is small com- pared to the solder paste volume that is placed on the land pattern of the PCB, the reflow profile will be determined by the requirements of the solder paste. Therefore, these devices are compatible with both lead-free and SnPb assembly techniques. In addition, unlike other lead-free compositions, matte tin does not have any added alloys that can cause degradation of the solder joint. 2 13 4 5 Applications Information |
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