SN54HC175, SN74HC175

QUADRUPLE D-TYPE FLIP-FLOPS

WITH CLEAR

SCLS299A – JANUARY 1996 – REVISED MAY 1997

1

POST OFFICE BOX 655303

Outputs

– Buffer/Storage Registers

– Shift Registers

– Pattern Generators

Small-Outline (D), Thin Shrink

Small-Outline (PW), and Ceramic Flat (W)

Packages, Ceramic Chip Carriers (FK), and

Standard Plastic (N) and Ceramic (J)

300-mil DIPs

description

These monolithic positive-edge-triggered D-type

flip-flops have a direct clear (CLR) input. The

’HC175 feature complementary outputs from

each flip-flop.

Information at the data (D) inputs meeting the

setup time requirements is transferred to the

outputs on the positive-going edge of the clock

(CLK) pulse. Clock triggering occurs at a

particular voltage level and is not directly related

to the transition time of the positive-going edge of

CLK. When CLK is at either the high or low level,

the D input has no effect at the output.

The SN54HC175 is characterized for operation

over the full military temperature range of –55

°C

to 125

°C. The SN74HC175 is characterized for

operation from –40

°C to 85°C.

FUNCTION TABLE

(each flip-flop)

INPUTS

OUTPUTS

CLR

CLK

D

Q

Q

L

X

X

L

H

H

↑

HH

L

H

↑

LL

H

H

L

X

Q0

Q0

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

SN54HC175 ...J OR W PACKAGE

SN74HC175 . . . D, N, OR PW PACKAGE

(TOP VIEW)

SN54HC175 . . . FK PACKAGE

(TOP VIEW)

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

CLR

1Q

1Q

1D

2D

2Q

2Q

GND

4Q

4Q

4D

3D

3Q

3Q

CLK

32

1 20 19

910 11 12 13

4

5

6

7

8

18

17

16

15

14

4Q

4D

NC

3D

3Q

1Q

1D

NC

2D

2Q

NC – No internal connection

Copyright

© 1997, Texas Instruments Incorporated

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of Texas Instruments

standard warranty. Production processing does not necessarily include

testing of all parameters.