SN74CBTLV3245A

LOW VOLTAGE OCTAL FET BUS SWITCH

SCDS034L − JULY 1997 − REVISED OCTOBER 2003

2

POST OFFICE BOX 655303

FUNCTION TABLE

INPUT

FUNCTION

INPUT

OE

FUNCTION

L

A port = B port

H

Disconnect

logic diagram (positive logic)

A1

SW

B1

A8

OE

SW

B8

2

9

19

18

11

simplified schematic, each FET switch

A

(OE)

B

−0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−0.5 V to 4.6 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous channel current

128 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−50 mA

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Package thermal impedance,

68

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): DGV package

92

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): DW package

58

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 2): PW package

83

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

(see Note 3): RGY package

37

°C/W

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not

implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.

2. The package thermal impedance is calculated in accordance with JESD 51-7.

3. The package thermal impedance is calculated in accordance with JESD 51-5.