TL5632CFR datasheet(6/9 Pages) TI

No. de pieza	TL5632CFR

Descripción Electrónicos	8-BIT 3-CHANNEL HIGH-SPEED DIGITAL-TO-ANALOG CONVERTER

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Fabricante Electrónico	TI [Texas Instruments]

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TL5632C

8-BIT 3-CHANNEL HIGH-SPEED DIGITAL-TO-ANALOG CONVERTER

SLAS091 – DECEMBER 1994

6

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

APPLICATION INFORMATION

The following design procedures should be used for optimum operation.

D External analog and digital circuitry should be physically separated and shielded as much as possible to

reduce system noise.

D RF breadboarding or RF printed-circuit-board (PCB) techniques should be used throughout the evaluation

and production process.

D Wide ground leads or a ground plane should be used on the PCB layouts to minimize parasitic inductance

and resistance. A ground plane is the better choice for noise reduction.

D AVCC and DVCC are also separate internally, so they must be connected externally. These external PCB

leads should also be made as wide as possible. A ferrite bead or equivalent inductance should be placed

in series with AVCC and the decoupling capacitor before the AVCC and DVCC leads are connected together

on the board. It is critical that the supply voltage applied to AVCC be as noise free and ripple free as possible.

Ripple and noise rejection should be a minimum of 60 dB below the full-scale output range of 1 V

peak-to-peak.

D AVCC to GND and DVCC to GND should be decoupled with 3.3-µF and 0.1-µF capacitors, respectively, as

close as possible to the appropriate device terminals. A ceramic chip capacitor is recommended for the

0.1-

µF capacitor.

D The phase compensation capacitor should be connected between CCOMP and GND with as short a lead-in

as possible.

D The no-connection (NC) terminals on the small-outline package should be connected to GND.

D AVCC, DVCC, and ROUT, GOUT, and BOUT should be shielded from the high-frequency terminals CLKR IN,

CLKG IN ,and CLKB IN and the input data terminals. GND traces should be placed on both sides of the ROUT,

GOUT, and BOUT traces on the PCB to the following signal processing stage. These output traces should

be as short as possible.

Número de pieza similar - TL5632CFR

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Texas Instruments	TL5632CFR	162Kb / 10P	[Old version datasheet] 8-BIT 3-CHANNEL HIGH-SPEED DIGITAL-TO-ANALOG CONVERTER

Fabricante Electrónico	No. de pieza	Datasheet	Descripción Electrónicos
Texas Instruments	TL5632	162Kb / 10P	[Old version datasheet] 8-BIT 3-CHANNEL HIGH-SPEED DIGITAL-TO-ANALOG CONVERTER
NXP Semiconductors	TDA8715	430Kb / 15P	8 - BIT HIGH SPEED ANALOG - TO - DIGITAL CONVERTER November 1990
	TDF8704	137Kb / 20P	8-bit high-speed analog-to-digital converter June 1994
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	TDA8714	154Kb / 24P	8-bit high-speed analog-to-digital converter 1997 Oct 29
	TDA8703	141Kb / 18P	8-bit high-speed analog-to-digital converter 1996 Aug 26
	TDA8716	167Kb / 21P	8-bit high-speed analog-to-digital converter 1996 Aug 26
Texas Instruments	TLC5540	231Kb / 18P	[Old version datasheet] 8-BIT HIGH-SPEED ANALOG-TO-DIGITAL CONVERTER
Exar Corporation	MP7684A	1Mb / 14P	CMOS 8 BIT HIGH SPEED ANALOG TO DIGITAL CONVERTER
Exar Corporation	MP7683	645Kb / 10P	CMOS 8 BIT HIGH SPEED ANALOG TO DIGITAL CONVERTER