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TPA0213DGQ Datasheet(PDF) 10 Page - Texas Instruments |
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TPA0213DGQ Datasheet(HTML) 10 Page - Texas Instruments |
10 / 11 page TPA0213 2-W MONO AUDIO POWER AMPLIFIER WITH HEADPHONE DRIVE SLOS276B – JANUARY 2000 – REVISED MARCH 2000 10 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 MECHANICAL DATA DGQ (S-PDSO-G10) PowerPAD ™ PLASTIC SMALL-OUTLINE PACKAGE 0,69 0,41 0,25 Thermal Pad (See Note D) 0,15 NOM Gage Plane 4073273/A 04/98 4,98 0,17 6 3,05 4,78 2,95 10 5 3,05 2,95 1 0,27 0,15 0,05 1,07 MAX Seating Plane 0,10 0,50 M 0,25 0 °–6° NOTES: A. All linear dimensions are in millimeters. B. This drawing is subject to change without notice. C. Body dimensions do not include mold flash or protrusion. D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane. This pad is electrically and thermally connected to the backside of the die and possibly selected leads. The dimension of the thermal pad is 1.40 mm (height as illustrated) × 1.80 (width as illustrated) mm (maximum). The pad is centered on the bottom of the package. PowerPAD is a trademark of Texas Instruments Incorporated. |
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