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TPS2211DB Datasheet(PDF) 3 Page - Texas Instruments |
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TPS2211DB Datasheet(HTML) 3 Page - Texas Instruments |
3 / 22 page TPS2211 SINGLE-SLOT PC CARD POWER INTERFACE SWITCH FOR PARALLEL PCMCIA CONTROLLERS SLVS156E – JULY 1997 – REVISED JANUARY 2001 3 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 TPS2211Y chip information This chip, when properly assembled, displays characteristics similar to those of the TPS2211. Thermal compression or ultrasonic bonding may be used on the doped-aluminum bonding pads. The chips may be mounted with conductive epoxy or a gold-silicon preform. CHIP THICKNESS: 15 TYPICAL BONDING PADS: 4 × 4 MINIMUM TJmax = 150°C TOLERANCES ARE ±10%. ALL DIMENSIONS ARE IN MILS. 77 140 VCCD0 VCCD1 3.3V 3.3V 5V 5V GND OC SHDN VPPD0 VPPD1 AVCC AVCC AVCC 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 AVPP 12V 2 1 16 15 14 13 BONDING PAD ASSIGNMENTS 13 12 11 10 9 8 7 6 5 4 3 TPS2211Y |
Número de pieza similar - TPS2211DB |
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Descripción similar - TPS2211DB |
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