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TPS62231DRY Datasheet(PDF) 4 Page - Texas Instruments

No. de Pieza. TPS62231DRY
Descripción  3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package
Descarga  28 Pages
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Fabricante  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS62231DRY Datasheet(HTML) 4 Page - Texas Instruments

 
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ELECTRICAL CHARACTERISTICS
TPS62230
TPS62231
TPS62232
SLVS941 – APRIL 2009 ..................................................................................................................................................................................................... www.ti.com
VIN = 3.6V, VOUT = 1.8V, EN = VIN, MODE = GND, TA = –40°C to 85°C
(1) typical values are at T
A = 25°C (unless otherwise
noted), CIN = 2.2µF, L = 2.2µH, COUT = 4.7µF, see parameter measurement information
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
SUPPLY
VIN
Input voltage range (2)
2.05
6
V
IOUT = 0mA. PFM mode enabled (Mode = 0)
22
40
µA
device not switching
IOUT = 0mA. PFM mode enabled (Mode = 0)
25
µA
IQ
Operating quiescent current
device switching, VIN = 3.6V, VOUT = 1.2V
IOUT = 0 mA. Switching with no load
3
mA
(MODE/DATA = VIN), PWM operation,
VOUT = 1.8V, L = 2.2µH
ISD
Shutdown current
EN = GND(3)
0.1
1
µA
Falling
1.8
1.9
V
VUVLO
Undervoltage lockout threshold
Rising
1.9
2.05
V
ENABLE, MODE THRESHOLD
VIH TH
Threshold for detecting high EN, MODE
2.05 V
≤ VIN ≤ 6V , rising edge
0.8
1
V
VIL TH HYS
Threshold for detecting low EN, MODE
2.05 V
≤ VIN ≤ 6V , falling edge
0.4
0.6
V
IIN
Input bias Current, EN, MODE
EN, MODE = GND or VIN = 3.6V
0.01
0.5
µA
POWER SWITCH
High side MOSFET on-resistance
600
850
RDS(ON)
VIN = 3.6V, TJmax = 85°C; RDS(ON) max value
m
Low Side MOSFET on-resistance
350
480
Forward current limit MOSFET
690
850
1050
mA
high-side
ILIMF
VIN = 3.6V, open loop
Forward current limit MOSFET low side
550
840
1220
mA
TSD
Thermal shutdown
Increasing junction temperature
150
°C
Thermal shutdown hysteresis
Decreasing junction temperature
20
°C
CONTROLLER
TONmin
Minimum ON time
VIN 3.6V, VOUT = 1.8V, Mode = high, IOUT = 0 mA
135
ns
TOFFmin
Minimum OFF time
40
ns
OUTPUT
VREF
Internal Reference Voltage
0.70
V
VOUT
Output voltage accuracy(4)
VIN = 3.6V, Mode = GND, device operating in PFM
0%
Mode, IOUT = 0mA
VIN = 3.6V, MODE = VIN,
TA = 25°C
–2.0%
2.0%
IOUT = 0 mA
TA = –40°C to 85°C
–2.5%
2.5%
DC output voltage load regulation
PWM operation, Mode = VIN = 3.6V, VOUT = 1.8 V
0.001
%/mA
DC output voltage line regulation
IOUT = 0 mA, Mode = VIN, 2.05V ≤ VIN ≤ 6V
0
%/V
tStart
Start-up Time
Time from active EN to VOUT = 1.8V, VIN = 3.6V,
100
µs
10
Ω load
ILK_SW
Leakage current into SW pin
VIN = VOUT = VSW = 3.6 V, EN = GND
(5)
0.1
0.5
µA
(1)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the
part/package in the application (
θ
JA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)).
(2)
The minimum required supply voltage for startup is 2.05V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold
(3)
Shutdown current into VIN pin, includes internal leakage
(4)
VIN = VO + 1.0 V
(5)
The internal resistor divider network is disconnected from FB pin.
4
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Copyright © 2009, Texas Instruments Incorporated
Product Folder Link(s): TPS62230 TPS62231 TPS62232


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