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AD6657EBZ Datasheet(PDF) 9 Page - Analog Devices |
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AD6657EBZ Datasheet(HTML) 9 Page - Analog Devices |
9 / 32 page AD6657 Rev. 0 | Page 9 of 32 ABSOLUTE MAXIMUM RATINGS THERMAL CHARACTERISTICS Table 6. Parameter Rating AVDD to AGND −0.3 V to +2.0 V DRVDD to AGND −0.3 V to +2.0 V VIN+x, VIN−x to AGND −0.3 V to AVDD + 0.2 V CLK+, CLK− to AGND −0.3 V to AVDD + 0.2 V SYNC to AGND −0.3 V to AVDD + 0.2 V VCMx to AGND −0.3 V to AVDD + 0.2 V CSB to AGND −0.3 V to DRVDD + 0.2 V SCLK to AGND −0.3 V to DRVDD + 0.2 V SDIO to AGND −0.3 V to DRVDD + 0.2 V PDWN to AGND −0.3 V to DRVDD + 0.2 V MODE to AGND −0.3 V to DRVDD + 0.2 V Digital Outputs to AGND −0.3 V to DRVDD + 0.2 V DCO+AB, DCO−AB, DCO+CD, DCO−CD to AGND −0.3 V to DRVDD + 0.2 V Operating Temperature Range (Ambient) −40°C to +85°C Maximum Junction Temperature Under Bias 150°C Storage Temperature Range (Ambient) −65°C to +150°C The values in Table 7 are per JEDEC JESD51-7 plus JEDEC JESD25-5 for a 2S2P test board. Typical θJA is specified for a 4-layer PCB with a solid ground plane. As shown in Table 7, airflow improves heat dissipation, which reduces θJA. In addi- tion, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces θJA. Table 7. Package Type Airflow Velocity θJA1 θJC2 θJB3 Unit 144-Ball CSP_BGA, 10 mm × 10 mm (BC-144-1) 0 m/s 26.9 8.9 6.6 °C/W 1 m/s 24.2 2.5 m/s 23.0 1 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air). 2 Per MIL-STD 883, Method 1012.1. 3 Per JEDEC JESD51-8 (still air). The values in Table 8 are from simulations. The PCB is a JEDEC multilayer board. Thermal performance for actual applications requires careful inspection of the conditions in the application to determine whether they are similar to those assumed in these calculations. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 8. Package Type Airflow Velocity Ψ JB Ψ JT Unit 144-Ball CSP_BGA, 10 mm × 10 mm (BC-144-1) 0 m/s 14.4 0.23 °C/W 1 m/s 14.0 0.50 2.5 m/s 13.9 0.53 ESD CAUTION |
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