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NST3906DP6T5G Datasheet(PDF) 1 Page - ON Semiconductor

No. de pieza NST3906DP6T5G
Descripción Electrónicos  Dual General Purpose Dual General Purpose
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Fabricante Electrónico  ONSEMI [ON Semiconductor]
Página de inicio  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

NST3906DP6T5G Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2008
April, 2008 − Rev. 0
1
Publication Order Number:
NST3906DP6/D
NST3906DP6T5G
Dual General Purpose
Transistor
The NST3906DP6T5G device is a spin−off of our popular
SOT−23/SOT−323/SOT−563three−leaded device. It is designed for
general purpose amplifier applications and is housed in the SOT−963
six−leaded surface mount package. By putting two discrete devices in
one package, this device is ideal for low−power surface mount
applications where board space is at a premium.
Features
hFE, 100−300
Low VCE(sat), ≤ 0.4 V
Simplifies Circuit Design
Reduces Board Space
Reduces Component Count
This is a Pb−Free Device
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
VCEO
−40
V
Collector−Base Voltage
VCBO
−40
V
Emitter−Base Voltage
VEBO
−5.0
V
Collector Current − Continuous
IC
−200
mA
Electrostatic Discharge
HBM
MM
ESD
Class
2
B
THERMAL CHARACTERISTICS
Characteristic (Single Heated)
Symbol
Max
Unit
Total Device Dissipation TA = 25°C
Derate above 25°C (Note 1)
PD
240
1.9
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
(Note 1)
RqJA
520
°C/W
Total Device Dissipation TA = 25°C
Derate above 25°C (Note 2)
PD
280
2.2
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
(Note 2)
RqJA
446
°C/W
Characteristic (Dual Heated) (Note 3)
Symbol
Max
Unit
Total Device Dissipation TA = 25°C
Derate above 25°C (Note 1)
PD
350
2.8
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
(Note 1)
RqJA
357
°C/W
Total Device Dissipation TA = 25°C
Derate above 25°C (Note 2)
PD
420
3.4
mW
mW/°C
Thermal Resistance, Junction-to-Ambient
(Note 2)
RqJA
297
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−55 to
+150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. FR−4 @ 100 mm2, 1 oz. copper traces, still air.
2. FR−4 @ 500 mm2, 1 oz. copper traces, still air.
3. Dual heated values assume total power is sum of two equally powered channels.
Q1
(1)
(2)
(3)
(4)
(5)
(6)
Q2
NST3906DP6T5G
ORDERING INFORMATION
http://onsemi.com
MARKING DIAGRAM
Device
Package
Shipping
NST3906DP6T5G
SOT−963
(Pb−Free)
8000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
SOT−963
CASE 527AD
PLASTIC
1 2
3
1
5
4
6
F M G
G
1
F
= Device Code
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)


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