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LA140B-Y-2-PF Datasheet(PDF) 6 Page - LIGITEK electronics co., ltd. |
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LA140B-Y-2-PF Datasheet(HTML) 6 Page - LIGITEK electronics co., ltd. |
6 / 6 page Page 5/5 Reference Standard MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1 JIS C 7021: B-12 MIL-STD-202:103B JIS C 7021: B-11 MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1 MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011 MIL-STD-883:1008 JIS C 7021: B-10 MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2 PART NO. LA140B/Y-2-PF Reliability Test: Test Condition Test Item Operating Life Test 1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs) High Temperature High Humidity Test Low Temperature Storage Test 1.Ta=-40 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) Thermal Shock Test Solder Resistance Test 1.T.Sol=260 ℃±5℃ 2.Dwell time= 10 ±1sec. 1.Ta=105 ℃±5℃&-40℃±5℃ (10min) (10min) 2.total 10 cycles 1.Ta=65 ℃±5℃ 2.RH=90 %~95% 3.t=240hrs ±2hrs 1.Ta=105 ℃±5℃ 2.t=1000 hrs (-24hrs, +72hrs) High Temperature Storage Test Solderability Test 1.T.Sol=230 ℃±5℃ 2.Dwell time=5 ±1sec Description This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed. The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours. The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. The purpose of this test is the resistance of the device under tropical for hous. This test intended to see soldering well performed or not. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only |
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