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SL1608R22JL Datasheet(PDF) 1 Page - ABC Taiwan Electronics Corp |
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SL1608R22JL Datasheet(HTML) 1 Page - ABC Taiwan Electronics Corp |
1 / 6 page ![]() SL1608□□□□L□-□□□ D : 0.4 typ. C : 0.8±0.2 B : 0.8±0.2 A : 1.6±0.2 2.7 0.9 SPECIFICATION FOR APPROVAL Time ( seconds ) 150 ( PCB Pattern ) c﹒Terminal:Solder coat over Ni plate (Lead content 100ppm max.) Ⅳ﹒ GENERAL SPECIFICATION: AR-001A e﹒Resistance to solder heat:260℃.10 secs. b﹒Rated current:Current cause inductance e﹒Remark:Products comply with RoHS' c﹒Storage temp.:-40℃ ----+125℃ d﹒Operating temp.:-40℃----+105℃ drop within 10% max. a﹒Temp rise :15℃ max d﹒Coating:Epoxy resin requirements 100 0 50 250 150 200 100 50 Max time above 200℃ :70sec max. Max time above 230℃ :50sec max. Peak Temp:260℃ max. +4.0 / sec max. ℃ Rising Area Temperature 150 ~ 200 / 60 ~ 120sec ℃ Preheat Area d NAME PROD. Ⅲ﹒ MATERIALS: Ⅱ﹒ SCHEMATIC DIAGRAM: Ⅰ﹒ CONFIGURATION & DIMENSIONS: REF : 0.9 B D D b﹒Wire :Copper a﹒Core:Ceramic WOUND CHIP INDUCTOR A ABC'S ITEM NO. ABC'S DWG NO. Peak Temperature: 200 250 70sec max. 50sec max. 260 ℃ 230 ℃ -(1.0 ~ 5.0) / sec max. ℃ Forced Cooling Area Reflow Area / sec max. +2.0 ~ 4.0℃ b 0.9 c a m/m m/m m/m m/m PAGE: 1 |
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