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STK416-090-E Datasheet(PDF) 3 Page - Sanyo Semicon Device |
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STK416-090-E Datasheet(HTML) 3 Page - Sanyo Semicon Device |
3 / 12 page STK416-090-E No. A1621-3/12 Continued from preceding page. *8: Thermal design must be implemented based on the conditions under which the customer’s end products are expected to operate on the market. *9: The thermoplastic adhesive is used to bond the case and the aluminum substrate, so, please be sure to fix the Hybrid IC on the heat sink before soldering and mount it. In addition, please attach and remove the heat sink at normal temperature. *10: Weight of HIC: 36.8g Outer carton dimensions (W ×L×H): 452mm×325mm×192mm Package Dimensions unit:mm (typ) Designated transformer power supply (MG-250 equivalent) 10000 μF 10000 μF DBA40C 500 Ω 500 Ω +VH -VH + + 10000 μF 10000 μF DBA40C 500 Ω 500 Ω +VL -VL + + Designated transformer power supply (MG-200 equivalent) 9.0 70.0 78.0 2.9 5.5 0.4 3.6 22 2.0=44.0 2.0 (13.0) 0.5 123 (R1.8) |
Número de pieza similar - STK416-090-E |
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Descripción similar - STK416-090-E |
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