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SS8061G Datasheet(PDF) 4 Page - Silicon Standard Corp. |
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SS8061G Datasheet(HTML) 4 Page - Silicon Standard Corp. |
4 / 6 page www.SiliconStandard.com 4 of 6 SS8061G 1/21/2005 Rev.2.01 TYPICAL PERFORMANCE CHARACTERISTICS (continued) 1.50 1.55 1.60 1.65 1.70 1.75 1.80 1.85 1.90 1.95 2.00 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (°C) 0 100 200 300 400 500 600 700 0 200 400 600 800 1000 IL (mA) VIN=3.0V VIN=5.0V 1.8 1.805 1.81 1.815 1.82 1.825 2.5 3.5 4.5 5.5 6.5 VIN (V) 1.784 1.789 1.794 1.799 1.804 1.809 1.814 1.819 1.824 -25 -15 -5 5 15 25 35 45 55 65 75 85 Temperature (°C) VIN=3.0V VIN=5.0V IL=10mA Max. Power Dissipation vs. TAMB Quiescent Current vs. Temperature Dropout Voltage vs. IL Output Voltage vs. Temperature Output Voltage vs. VIN T=25°C T=85°C T=-25°C T=25°C T=85°C T=-25°C 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 0 123 4 5 PCB Top Copper Area (in 2) 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 25 35 45 55 65 75 85 TAMB (°C) A=0.1 A=0.2 A=0.3 A=0.4 A=0.5 A=1.0 A=1.5 A=2.0 A=2.5 A=3.0 A=3.5 A=4.0 A=4.5 A=5.0 Max. Power Dissipation vs. PCB Top Copper Area Unit:in 2 |
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