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TPS622313 Datasheet(PDF) 3 Page - Texas Instruments

No. de Pieza. TPS622313
Descripción  2 MHz / 3 MHz Ultra Small Step Down Converter in 1x1.5 SON Package
Descarga  32 Pages
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Fabricante  TI [Texas Instruments]
Página de inicio  http://www.ti.com
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TPS622313 Datasheet(HTML) 3 Page - Texas Instruments

 
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TPS62230, TPS62231, TPS62232, TPS62233, TPS62234
TPS62235, TPS62236, TPS62237, TPS62238, TPS62239
TPS622310, TPS622311, TPS622312, TPS622313, TPS622314
www.ti.com
SLVS941C – APRIL 2009 – REVISED APRIL 2010
DISSIPATION RATINGS
(1)
POWER RATING
DERATING FACTOR
PACKAGE
RqJA
FOR TA ≤ 25°C
ABOVE TA = 25°C
1 × 1.5 SON
234°C/W(2)
420 mW
4.2 mW/°C
(1)
Maximum power dissipation is a function of TJ(max), qJA and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = [TJ(max) – TA] /qJA.
(2)
This thermal data is measured with high-K board (4 layers board according to JESD51-7 JEDEC standard).
RECOMMENDED OPERATING CONDITIONS
operating ambient temperature TA = –40 to 85°C (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
Supply voltage VIN
(2)
2.05
6
V
Effective inductance
2.2
mH
Effective capacitance
2.0
4.7
mF
VOUT ≤ VIN -1 V
(3)
500 mA maximum IOUT
(4)
3.0
3.6
Recommended minimum
350mA maximum IOUT
(5)
2.5
2.7
V
supply voltage
VOUT ≤ 1.8V
60 mA maximum output current(5)
2.05
Operating virtual junction temperature range, TJ
–40
125
°C
(1)
In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may
have to be derated. Maximum ambient temperature (TA(max)) is dependent on the maximum operating junction temperature (TJ(max)), the
maximum power dissipation of the device in the application (PD(max)), and the junction-to-ambient thermal resistance of the part/package
in the application (qJA), as given by the following equation: TA(max) = TJ(max) – (qJA × PD(max)).
(2)
The minimum required supply voltage for startup is 2.05 V. The part is functional down to the falling UVL (Under Voltage Lockout)
threshold.
(3)
For a voltage difference between minimum VIN and VOUT of ≥ 1 V
(4)
Typical value applies for TA = 25°C, maximum value applies for TA = 70°C with TJ ≤ 125°C, PCB layout needs to support proper thermal
performance.
(5)
Typical value applies for TA = 25°C, maximum value applies for TA = 85°C with TJ ≤ 125°C, PCB layout needs to support proper thermal
performance.
Copyright © 2009–2010, Texas Instruments Incorporated
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